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PDF EMIF02-MIC02F3 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-MIC02F3 | |
| Descripción | 2-line IPAD and EMI filter including ESD protection | |
| Fabricantes | STMicroelectronics | |
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EMIF02-MIC02F3
2-line IPAD™, EMI filter including ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency EMI filtering
■ Lead-free package
■ Very low PCB space consumption: 0.9 mm2
■ Very thin package: 0.60 mm
■ High efficiency ESD suppression
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC61000-4-2 level 4 on external pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ IEC61000-4-2 level 1 on internal pins:
– 2 kV (air discharge)
– 2 kV (contact discharge)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■ Mobile phones and communication systems
■ Computers, printers and MCU Boards
Description
The EMIF02-MIC02F3 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference.
This filter includes ESD protection circuitry, which
prevents damage to the protected device when
subjected to ESD surges up 15 kV.
Flip Chip
(6 bumps)
Figure 1. Pin layout (bump side)
32 1
E2 GND E1
I2 GND I1
A
B
Figure 2. Basic cell configuration
Low-pass Filter
I1 E1
I2 E2
GND
GND
GND
Ri/o = 470 Ω
Cline = 16 pF
April 2008
TM: IPAD is a trademark of STMicroelectronics.
Rev 2
1/8
www.st.com
1 page  
EMIF02-MIC02F3
3 Ordering information scheme
Ordering infworwmwa.DtiaotanSshecehte4Um.ceom
Figure 12. Ordering information scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: Lead-free, pitch = 400 µm, bump = 255 µm
4 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 13. Package dimensions
400 µm ± 40
185 µm ± 10
605 µm ± 55
0.77 mm ± 30 µm 255 µm ± 40
5/8
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-MIC02F3.PDF ] | |
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