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PDF ACMD-7401 Data sheet ( Hoja de datos )
| Número de pieza | ACMD-7401 | |
| Descripción | Miniature PCS Band Duplexer | |
| Fabricantes | Agilent | |
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Agilent ACMD-7401
www.DataSheet4U.com
Miniature PCS Band Duplexer
Data Sheet
Description
The ACMD-7401 is a miniaturized
duplexer designed using Agilent's
Film Bulk Acoustic Resonator
(FBAR) technology. The ACMD-
7401 is the first duplexer built
with Agilent's innovative
Microcap bonded-wafer chip
scale packaging technology. This
process allows the ultra small
filters to be assembled in a
molded chip-on-board (MCOB)
module that is less than 1.4 mm
high with a 5 x 5 mm footprint.
The ACMD-7401 enhances the
sensitivity and dynamic range of
CDMA receivers, providing more
than 50 dB attenuation of transmit-
ted signal at the receiver input, and
more than 40 dB rejection of the
transmit-generated noise in the
receive band. Typical insertion loss
in the Tx channel is only 1.8 dB,
minimizing current drain from the
power amplifier. Typical insertion
loss in the Rx channel is 2.2 dB,
improving receiver sensitivity.
Agilent’s thin-film Bulk Acoustic
Resonator (FBAR) technology
makes possible high-Q filters at a
fraction their usual size. The
excellent power handling of the
bulk-mode resonators supports
the high output powers needed in
PCS handsets, with virtually no
added distortion.
Features
• Miniature size: less than 1.4 mm
high, 5 x 5 mm footprint
• Rx Band: 1930 – 1990 MHz typical
performance:
Rx Noise Blocking: 44 dB
Insertion Loss: 2.2 dB typical,
3.0 dB band edge
• Tx Band: 1850 – 1910 MHz typical
performance:
Tx Interferer Blocking: 54 dB
Insertion Loss: 1.8 dB typical,
2.5 dB band edge
• 30 dBm Tx Power Handling
Applications
• Handsets or data terminals
operating in the US PCS frequency
band
1 page  
Applications Information
Agilent’s ACMD-7401 duplexers
provide high RF performance in
a very small package. However, in
order to achieve all the perfor-
mance available from the
duplexer, care must be taken in
the design of the board onto
which it is mounted. The purpose
of this information is to provide
Agilent’s recommendations on
the design of that board (called
the motherboard in this note).
Areas where care in design must
be observed are thermal ground,
RF ground, in/out connection
design, and solder mask/solder
stencil design. These four design
areas, which are sometimes
interrelated, will be considered
one at a time below.
(and other parameters) will be met
at the specified input power level
and motherboard temperature.
Note that high power/high tem-
perature testing done at Agilent is
performed with the duplexer
soldered down to a test board
having a very good heat sink.
The motherboard must be de-
signed to remove heat from the
duplexer with the lowest possible
thermal resistance. Mount the
duplexer on a large surface of
1/2 ounce copper ground plane
(as shown in Figure 14), to enable
0
-10
the heat to be rwemwwov.DeadtainShaelel t4U.com
directions. Via holes, necessary
for RF grounding, should be filled
with copper plating to further
remove heat from the duplexer’s
Tx filter and dump it into a
second ground plane located in a
lower layer of the motherboard.
FBAR duplexers have extremely
low thermal mass and must be
properly heat sunk, as well as
isolated from external sources of
heat (such as a nearby power
amplifier). Failure to provide an
adequate thermal design to cool
Thermal Ground
FBAR resonators have a negative
temperature coefficient of
frequency — as temperature goes
up, the frequency response of the
filter shifts down in frequency.
See Figure 12. Typical coeffi-
cients are 57 KHz/° C for the Tx
filter and 40 KHz/° C for the Rx
filter. In Figure 13, the same data
are presented with the scale
narrowed down to the upper end
of the Tx band. Note that all
these data are taken at low input
power levels (+10 dBm).
When input power is +29 dBm,
heating in the Tx filter due to RF
losses causes the filter membranes
to heat up beyond 85°C. This, in
turn, causes the filter response to
shift further left (down in fre-
quency), resulting in increased
insertion loss at the high end of
the Tx band (1910 MHz). Agilent
Technologies takes this into
account in the manufacture and
final test of the duplexer — all
specifications for insertion loss
-20
-30
-40
-50
-60
1.82 1.86 1.90 1.94
FREQUENCY (GHz)
Figure 12. Tx Filter Response with Temperature.
-30°C
25°C
85°C
1.98
2.02
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
1.845
1.855
1.865
1.875
-30°C
25°C
85°C
1.885 1.895
1.905
FREQUENCY (GHz)
Figure 13. Tx Filter Response with Temperature (expanded).
1.915
5
5 Page 
Sprocket holes
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Pocket cavity
Figure 23. Unit Orientation in Tape.
Package pin 1 orientation
Ordering Information
Part Number
ACMD-7401-BLK
ACMD-7401-TR1
No. of Devices
100
1000
Container
Anti-static bag
7” Reel
www.DataSheet4U.com
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (65) 6756 2394
India, Australia, New Zealand: (65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand, Philippines,
Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
May 25, 2004
5989-0533EN
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet ACMD-7401.PDF ] | |
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