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EMIF02-USB05C2 Schematic ( PDF Datasheet ) - STMicroelectronics

Teilenummer EMIF02-USB05C2
Beschreibung 2 line EMF filter including ESD protection
Hersteller STMicroelectronics
Logo STMicroelectronics Logo 




Gesamt 7 Seiten
EMIF02-USB05C2 Datasheet, Funktion
www.DataSheet4U.com
IPAD™
EMIF02-USB05C2
2 line EMF filter including ESD protection
Main application
When EMI filtering is ESD sensitive equipment is
required:
Mobile phones and communication systems
Computers, printers and MCU boards
Description
The EMIF02-USB05C2 is a highly integrated
array designed to suppress EMI / RFI noise for
USB port filtering. The EMIF02-USB05C2 Flip-
Chip packaging means the package size is equal
to the die size.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
This device is designed to be fully compatible with
USB standards.
Benefits
2 x EMI low-pass filter + 2 line ESD protection
1.5 kΩ pull-up included
High efficiency in EMI filtering
Lead free coated package
Very low PCB space consumption:
1.92 mm x 0.92 mm
Very thin package: 0.69 mm
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging
USB full speed (12 Mbps), OTG compliant
Complies with following standards:
IEC 61000-4-2
level 4
15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883G - Method 3015-7 Class 3
Coated Flip-Chip
(8 Bumps)
Pin configuration (bump side)
21
IO4 VCC A
O2 I2 B
O1 I1 C
IO3 GND D
Functional diagram
IO4
IO3
Input 2
R3
R1
VCC
Output2
GND
Input 1
R2
Output 1
Order code
Part Number
EMIF02-USB05C2
Marking
GV
TM: IPAD is a trademark of STMicroelectronics
November 2006
Rev 2
1/7
www.st.com
7






EMIF02-USB05C2 Datasheet, Funktion
Ordering information
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Note:
More packing information is available in the application notes
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
4 Ordering information
Ordering code
EMIF02-USB05C2
Marking
GV
Package
Flip-Chip
Weight
2.7 mg
Base qty
5000
Delivery mode
Tape and reel 7”
5 Revision history
Date
14-Mar-2005
13-Nov-2006
Revision
Changes
1 Initial release.
2
Reformatted to current standards. Modified functional diagram on
page 1 to show connections. Updated Aplac model information.
6/7

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