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PDF EMIF02-USB02F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-USB02F2 | |
| Descripción | USB02F2 - 2-line IPAD EMI filter | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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EMIF02-USB02F2
2-line IPAD™, EMI filter with ESD protection
Features
■ 2-line low-pass filter + ESD protection
■ High efficiency in EMI filtering
■ Lead-free package
■ Very low PCB space occupation < 3.2 mm2
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards:
■ IEC 61000-4-2
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883E - Method 3015-6 Class 3
Application
EMI filtering and ESD protection for USB port.
Description
The EMIF02-USB02F2 is a highly integrated array
designed to suppress EMI / RFI noise for a USB
port. The EMIF02-USB02F2 Flip Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes ESD protection
circuitry which prevents damage to the application
when subjected to ESD surges up to 15 kV.
Flip Chip
(10 bumps)
Figure 1.
Pin layout (bump side)
4 321
VCC I6 A
I4 I5
B
O2 I2
I3 GND
C
D
O1 I1 E
Figure 2. Basic cell configuration
I6
I5
I4
R4 10kΩ
I3
D1
GND
R3 1.3kΩ
R2 33Ω
I2
25pF
25pF
25pF
25pF
R1 33Ω
I1
VCC
O2
GND
O1
April 2008
Rev 2
1/7
www.st.com
7
1 page  
EMIF02-USB02F2
4 Package information
Pacwkwawge.DiantafoShrmeeat4tiUo.cnom
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 10. Flip Chip package dimensions
700µm ± 50
315µm ± 50
650µm ± 65
495µm ± 50
495µm ± 50
285 µm
1.62mm ± 50µm
Figure 11. Footprint recommendations
Copper pad Diameter:
250 µm recommended, 300 µm max.
Solder stencil opening:
330 µm recommended
Figure 12. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening recommendation:
340 µm min. for 300 µm copper pad diameter
E
xxz
y ww
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-USB02F2.PDF ] | |
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