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EMIF02-SPK01F2 Schematic ( PDF Datasheet ) - STMicroelectronics

Teilenummer EMIF02-SPK01F2
Beschreibung 2 LINE EMI FILTER AND ESD PROTECTION
Hersteller STMicroelectronics
Logo STMicroelectronics Logo 




Gesamt 7 Seiten
EMIF02-SPK01F2 Datasheet, Funktion
www.DataSheet4U.com
®
IPAD™
EMIF02-SPK01F2
2 LINE EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
Mobile phones and communication systems
Computers, printers and MCU Boards
DESCRIPTION
The EMIF02-SPK01 is a highly integrated device
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences. The
EMIF02 Flip-Chip packaging means the package
size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV.
BENEFITS
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Very low PCB space consuming:
1.07 mm x 1.47 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
High reliability offered by monolithic integration
High reducing of parasitic elements through inte-
gration & wafer level packaging
Flip-Chip
(5 Bumps)
Table 1: Order Code
Part Number
EMIF02-SPK01F2
Marking
FX
Figure 1: Pin Configuration (bump side)
321
I2 I1
A
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC 61000-4-2
Level 4 on input pins 15 kV (air discharge)
8 kV (contact discharge)
Level 1 on output pins 2 kV (air discharge)
2 kV (contact discharge)
MIL STD 883E -Method 3015-6 Class 3
Figure 2: Basic Cell Configuration
GND
O2 O1
B
C
Low-pass Filter
Input
Output
Ri/o = 10
Cline = 200 pF
GND
GND
TM: IPAD is a trademark of STMicroelectronics.
October 2005
GND
REV 1
1/7






EMIF02-SPK01F2 Datasheet, Funktion
EMIF02-SPK01F2
Figure 14: FLIP-CHIP Tape and Reel Specification
Dot identifying Pin A1 location
4 ± 0.1
www.DataSheet4U.com
Ø 1.5 ± 0.1
ST E
xxz
yww
ST E
xxz
yww
ST E
xxz
yww
0.73 ± 0.05
All dimensions in mm
4 ± 0.1
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 4: Ordering Information
Ordering code
EMIF02-SPK01F2
Marking
FX
Package
Flip-Chip
Weight
2.1 mg
Base qty
5000
Delivery mode
Tape & reel (7”)
Note: More packing informations are available in the application notes
AN1235: ''Flip-Chip: Package description and recommandations for use''
AN1751: "EMI Filters: Recommendations and measurements"
Table 5: Revision History
Date
14-Oct-2004
Revision
1
First issue
Description of Changes
6/7

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