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PDF EMIF02-AV01F3 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-AV01F3 | |
| Descripción | Dual audio and video line IPAD / EMI filter and ESD protection | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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EMIF02-AV01F3
Dual audio and video line IPAD™, EMI filter and ESD protection
Features
■ High-density capacitor
■ EMI low-pass filter and ESD protection
■ High-efficiency in EMI filtering
■ Lead-free package
■ 400 µm pitch
■ Very small PCB footprint: 0.91 mm x 1.31 mm
■ Very thin package: 0.605 mm
■ High reliability offered by monolithic integration
■ Reduction of parasitic elements thanks to CSP
integration
Complies with the following standards
■ IEC 61000-4-2 level 4 on external pin (A2, C2)
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ IEC 61000-4-2 level 1 on internal pin (A1, C1)
– 2 kV (air discharge)
– 2 kV (contact discharge)
Application
■ Dual audio and video line interface protection
and filtering in mobile phones
Description
The EMIF02-AV01F3 is a highly integrated array
designed to suppress EMI / RFI noise and provide
impedance matching for mobile phones and
portable applications.
The EMIF02-AV01F3 is in Flip Chip package to
offer space saving and high RF performance.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
Flip Chip
5 bumps
Figure 1. Pin configuration (bump side
view)
12
A
B
C
Figure 2. Schematic
R
A1
2 kV
B2
Gnd
2 kV
C1
15 kV
15 kV
R
A2
C
C
C2
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 3
1/7
www.st.com
7
1 page  
EMIF02-AV01F3
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Figure 11. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 12. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y ww
Figure 13. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.01
Note:
0.71 ± 0.05
4 ± 0.1
All dimensions in mm
User direction of unreeling
Note: More information is available in the application note:
AN2348:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
4 Ordering information
Table 3. Ordering information
Order code
Marking
Package
EIMF02-AV01F3
HH
Flip Chip
Weight
1.4 mg
Base qty
5000
Delivery mode
Tape and reel 7”
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-AV01F3.PDF ] | |
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