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Número de pieza | ADP2118 | |
Descripción | 1.2 MHz/600 kHz High Efficiency Synchronous Step-Down DC-to-DC Converter | |
Fabricantes | Analog Devices | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de ADP2118 (archivo pdf) en la parte inferior de esta página. Total 24 Páginas | ||
No Preview Available ! 3 A, 1.2 MHz/600 kHz High Efficiency
Synchronous Step-Down DC-to-DC Converter
ADP2118
FEATURES
3 A continuous output current
75 mΩ and 40 mΩ integrated FET
±1.5% output accuracy
Input voltage range from 2.3 V to 5.5 V
Output voltage from 0.6 V to VIN
600 kHz or 1.2 MHz fixed switching frequency
Synchronizable between 600 kHz and 1.4 MHz
Selectable synchronize phase shift: 0o or 180o
Selectable PWM or PFM mode operation
Current mode architecture
Precision enable input
Power good output
Voltage tracking input
Integrated soft start
Internal compensation
Starts up into a precharged output
UVLO, OVP, OCP, and thermal shutdown
Available in 16-lead 4mm × 4mm LFCSP_WQ package
APPLICATIONS
DSP/FPGA/ASIC core power
Telecommunication/networking equipment
PDAs and palmtop computers
Audio/video consumer electronics
GENERAL DESCRIPTION
The ADP2118 is a low quiescent current, synchronous, step-down,
dc-to-dc converter in a compact 4mm × 4mm LFCSP_WQ
package. It uses a current mode, constant frequency pulse-width
modulation (PWM) control scheme for excellent stability and
transient response. Under light loads, the ADP2118 can be
configured to operate in pulse frequency modulation (PFM)
mode that reduces switching frequency to save power.
The ADP2118 runs from input voltages of 2.3 V to 5.5 V. The
output voltage of the ADP2118ACPZ-R7 is adjustable from
0.6 V to input voltage (VIN), and the ADP2118ACPZ-x.x-R7 are
available in preset output voltage options of 3.3 V, 2.5 V, 1.8 V,
1.5 V, 1.2 V, and 1.0 V. The ADP2118 requires minimal external
parts and provides a high efficiency solution with its integrated
power switch, synchronous rectifier, and internal compensation.
The IC draws less than 3 μA from the input source when it is
disabled. Other key features include undervoltage lockout
(UVLO), integrated soft start to limit inrush current at startup,
overvoltage protection (OVP), overcurrent protection (OCP),
and thermal shutdown (TSD).
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R2
10kΩ
16
C1
0.1µF
R1
10Ω
15 14 13
CIN
100µF
X5R,
6.3V
VIN
5V
1 SYNC/MODE
2 FREQ
3 TRK
ADP2118
4 FB
PVIN 12
SW 11
SW 10
SW 9
L
1µH
VOUT
COUT
100µF
3.3V
3A
X5R,
6.3V
RBOT RTOP
2.21kΩ 10kΩ
5678
Figure 1. Typical Applications Circuit
100
90
80
70
60
50
40
30
20
10
0
0.01
PFM OPERATION
FPWM OPERATION
VfVSION=U=T1.5=2VM3.H3Vz
0.1 1 10
OUTPUT CURRENT (A)
Figure 2. Efficiency vs. Output Current
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2009 Analog Devices, Inc. All rights reserved.
1 page ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, PVIN
SW
FB, SYNC/MODE, EN, TRK, FREQ, PGOOD
PGND to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +0.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADP2118
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
16-Lead LFCSP_WQ
θJA Unit
38.3 °C/W
Boundary Conditions
θJA is measured using natural convection on a JEDEC 4-layer
board, and the exposed pad is soldered to the printed circuit
board with thermal vias.
ESD CAUTION
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Rev. 0 | Page 5 of 24
5 Page VOUT
1
SW
2
IL
4
CH1 500mV CH2 5V
CH4 5A Ω
M2ms
T 29.60%
A CH1 670mV
Figure 28. Output Short
TRK
FB
1
CH1 500mV
CH2 500mV M4ms
T 59%
A CH2
Figure 29. Tracking Function
640mV
VOUT (AC)
1
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IL
4
SW
2
CH1 10mV
CH2 5V
CH4 1A Ω
M 400ns
T 57.80%
A CH2 3.90V
Figure 30. Discontinuous Conduction Mode (DCM)
ADP2118
VOUT
1
SW
2
IL
4
CH1 500mV CH2 5V
CH4 5A Ω
M2ms
T 59.60%
A CH1 670mV
Figure 31. Output Short Recovery
1
VOUT (AC)
IL
4
SW
2
CH1 50mV
CH2 5V
CH4 1A Ω
M4µs
T 64.60%
Figure 32. PFM Mode
A CH4
1.72A
VOUT (AC)
1
IL
4
SW
2
CH1 10mV CH2 5V
CH4 2A Ω
M400ns
T 57.8%
A CH2 3.1V
Figure 33. Continuous Conduction Mode (CCM)
Rev. 0 | Page 11 of 24
11 Page |
Páginas | Total 24 Páginas | |
PDF Descargar | [ Datasheet ADP2118.PDF ] |
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