ADP125 Datasheet PDF - Analog Devices
| Part Number | ADP125 | |
| Description | (ADP124 / ADP125) CMOS LINEAR REGULATOR W/31 FIXED-OUTPUT VOLTAGES | |
| Manufacturers | Analog Devices | |
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5.5 V Input, 500 mA, Low Quiescent
Current, CMOS Linear Regulators
ADP124/ADP125
FEATURES
Input voltage supply range: 2.3 V to 5.5 V
500 mA maximum output current
Fixed and adjustable output voltage versions
1% initial accuracy
Up to 31 fixed-output voltage options available
from 1.75 V to 3.3 V
Adjustable-output voltage range from 0.8 V to 5.0 V
Very low dropout voltage: 130 mV
Low quiescent current: 45 μA
Low shutdown current: <1 μA
Excellent PSRR performance: 60 dB at 100 kHz
Excellent load/line transient response
Optimized for small 1.0 μF ceramic capacitors
Current limit and thermal overload protection
Logic controlled enable
Compact 8-lead exposed paddle MSOP package
APPLICATIONS
Digital camera and audio devices
Portable and battery-powered equipment
Automatic meter reading (AMR) meters
GPS and location management units
Medical instrumentation
Point of load power
TYPICAL APPLICATION CIRCUITS
VOUT = 3.3V
C2
1 VOUT VIN 8
ADP124
2 VOUT VIN 7
VIN = 5.5V
C1
3
VOUT
SENSE
4 GND
NC 6
ON
EN 5
OFF
Figure 1. ADP124 with Fixed Output Voltage
VOUT = 3.3V
C2 R1
R2
1 VOUT VIN 8
ADP125
2 VOUT VIN 7
VIN = 5.5V
C1
3 ADJ
4 GND
NC 6
ON
EN 5
OFF
Figure 2. ADP 125 with Adjustable Output Voltage
GENERAL DESCRIPTION
www.DaTthaeShAeDetP41U2.c4o/AmDP125 are low quiescent current, low dropout
linear regulators. They are designed to operate from an input
voltage between 2.3 V and 5.5 V and to provide up to 500 mA of
output current. The low 130 mV dropout voltage at a 500 mA
load improves efficiency and allows operation over a wide input
voltage range.
The low 210 μA of quiescent current with a 500 mA load makes the
ADP124/ADP125 ideal for battery-operated portable equipment.
The ADP124 is capable of 31 fixed-output voltages from 1.75 V
to 3.3 V. The ADP125 is the adjustable version of the device and
allows the output voltage to be set between 0.8 V and 5.0 V by
an external voltage divider.
The ADP124/ADP125 are specifically designed for stable operation
with tiny 1 μF ceramic input and output capacitors to meet the
requirements of high performance, space constrained applications.
The ADP124/ADP125 have an internal soft start that gives a
constant start-up time of 350 μs. Short-circuit protection and
thermal overload protection circuits prevent damage in adverse
conditions. The ADP124/ADP125 are available in an 8-lead
exposed paddle MSOP package. When compared with the
standard MSOP package, the exposed paddle MSOP package
has lower thermal resistance (θJA). The lower thermal resistance
package allows the ADP124/ADP125 to meet the needs of a
variety of portable applications while minimizing the rise in
junction temperature.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2009 Analog Devices, Inc. All rights reserved.
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ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
ADJ to GND
EN to GND
VOUT to GND
Storage Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Rating
−0.3 V to +6.5V
−0.3 V to +4 V
−0.3 V to +6.5V
−0.3 V to VIN
−65°C to +150°C
−40°C to +85°C
−40°C to +125°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP124/ADP125 can be damaged when the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that TJ will remain within the
specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum ambient
temperature may have to be limited.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
www.DathtaeSdheeveitc4eUi.scdomependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-ambient
thermal resistance of the package (θJA).
Maximum junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) using the
formula
TJ = TA + (PD × θJA)
The junction-to-ambient thermal resistance (θJA) of the package
is based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on the
ADP124/ADP125
application and board layout. In applications in which high maxi-
mum power dissipation exists, close attention to thermal board
design is required. The value of θJA may vary, depending on PCB
material, layout, and environmental conditions. The specified
values of θJA are based on a 4-layer, 4 inch × 3 inch circuit board.
Refer to JESD 51-7 for detailed information on the board
construction
ΨJB is the junction-to-board thermal characterization parameter
and is measured in °C/W. The ΨJB of the package is based on
modeling and calculation using a 4-layer board. The Guidelines for
Reporting and Using Package Thermal Information: JESD51-12
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power flowing
through multiple thermal paths rather than a single path as in
thermal resistance, θJB. Therefore, ΨJB thermal paths include
convection from the top of the package as well as radiation from
the package—factors that make ΨJB more useful in real-world
applications. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
TJ = TB + (PD × ΨJB)
Refer to JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
8-Lead MSOP
102.8
ΨJB
31.8
Unit
°C/W
ESD CAUTION
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