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PDF AN1580 Data sheet ( Hoja de datos )
| Número de pieza | AN1580 | |
| Descripción | MOUNTING AND SOLDERING RECOMMENDATIONS | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de AN1580 (archivo pdf) en la parte inferior de esta página. Total 4 Páginas | ||
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MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
Mounting and Soldering Recommendations
for the Motorola Power Flat Pack Package
Order this document
by AN1580/D
AN1580
Prepared by: Jose Torres
Motorola Semiconductor Products Sector
Phoenix, AZ
PFP–16
INTRODUCTION
Motorola’s Power Flat Pack–16 (PFP–16) is an overall
superior package for high power surface mount applications.
It is thin, space efficient, with a variety of processes to solder
it to a printed circuit board (PC board). The PFP–16 is
mounted and soldered like many other surface mount
packages. Unlike most surface mount packages, it has a very
high thermal conductivity, permitting die to dissipate up to 5
watts without consuming excessive board space. This
document offers some considerations to help manufacturers
using the Motorola PFP–16 take full advantage of the PFP–16
package.
WHY DOES MOTOROLA USE THE PFP–16?
Motorola uses the PFP–16 because it provides a
convenient, economical and efficient way to package a high
power (up to 5 watts) RF semiconductor device, all without
compromising the high quality standards that Motorola’s
customers have come to expect. The PFP–16 is convenient
as it can be assembled into PC boards using standard
equipment. It is relatively simple to put on a board already
populated with the common SOIC or TSSOP packages. The
PFP–16 is also economical because it is compact, both in area
and height, especially for high power applications. It is efficient
because it has excellent thermal conductivity which allows the
www.DatcaoSnhteaeint4eUd.cdoime to operate at higher power consumption levels.
16 15 14 13 12 11 10
9
123
4 5678
0.1 mm MAX
SPEC. LIMIT
BASIS PLANE
SPEC. VOLUME
NOTE: LEG HEIGHTS & TOLERANCE EXAGGERATED FOR CLARITY
Figure 1. Coplanarity Specification
The PFP–16 package has many advantages which
manufacturers can pass on to their customers.
PACKAGE DESCRIPTION
The PFP–16 is essentially a thin, flat, rigid plastic case
covering a silicon or GaAs chip. The package incorporates
two rows of thin, gull wing metal leads that protrude from two
opposing sides and a square solderable contact underneath.
The plastic case is nominally 2.05 millimeters high by 7 mm
long and 7 mm wide. The 16 leads extend the package width
by 2 mm to 9 mm total. The solderable contact exposed on the
bottom center of the plastic package is nominally 4.75 mm
long by 4.75 mm wide. A 45° chamfer on one corner of the
package designates pin 1 and makes its orientation easily
distinguishable.
While the package dimensions are easy to describe in
general terms, there are three important characteristics which
merit detailed description: the contact surfaces of the leads
are coplanar within a 0.10 mm tolerance; the heat sink surface
stands off the mounting plane from 0.025 to 0.152 mm; and the
feet of the leads have an angle tolerance between horizontal
(flat) and 8° below horizontal (tipped down). These conditions
are used by Motorola to ensure quality and make reflow
processes easier for our customers. Each condition is defined
in the following paragraphs.
STANDOFF
MINIMUM
0.025
IDEAL COPLANAR LEADS
0.025
TO
0.152
NORMAL
STANDOFF
RANGE
(SIDE VIEW)
STANDOFF
MINIMUM
0.125
WORST CASE
AT COPLANARITY
0.10 MAXIMUM LIMIT,
STANDOFF
MINIMUM
IS HIGHER
NOTE: LEG HEIGHTS EXAGGERATED FOR CLARITY
(ALL UNITS IN MILLIMETERS)
Figure 2. Standoff Specification
REV 3
©MMOotoTrOolaR, IOncL. A199R7F APPLICATIONS REPORT
1
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet AN1580.PDF ] | |
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