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Número de pieza | HMC663LC3 | |
Descripción | Double-Balanced High IP3 SMT Mixer | |
Fabricantes | Hittite Microwave Corporation | |
Logotipo | ||
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v02.0309
Typical Applications
The HMC663LC3 is ideal for:
• Point-to-Point Radios
• Point-to-Mulit-Point Radios
• Test Equipment & Sensors
9 • Military End-Use
Functional Diagram
HMC663LC3
GaAs MMIC DOUBLE-BALANCED
HIGH IP3 MIXER, 6 - 12 GHz
Features
High LO/RF Isolation: 40 dB
Wide IF Bandwidth: DC - 4 GHz
Passive Double-Balanced Topology
Low Conversion Loss: 8 dB
12 Lead Ceramic 3x3mm SMT Package: 9mm2
General Description
The HMC663LC3 is a general purpose double
balanced mixer in a leadless RoHS compliant ceramic
SMT package that can be used as an upconverter or
downconverter between 6 and 12 GHz. This passive
mixer is fabricated in a GaAs MESFET process,
requires no DC Bias and no external components or
matching circuitry.
The HMC663LC3 provides excellent LO to RF and LO
to IF isolation due to optimized balun structures and
operates with LO drive levels as low as +17 dBm. The
HMC663LC3 eliminates the need for wire bonding,
and is compatible with high volume surface mount
manufacturing techniques.
Electrical Specifications, TA = +25° C, IF= 100 MHz, LO= +21 dBm*
Parameter
Min.
Typ.
Frequency Range, RF
6 to 12
Frequency Range, LO
6 to 14
Frequency Range, IF
DC to 4
Conversion Loss
8
Noise Figure (SSB)
10
LO to RF Isolation
29 40
LO to IF Isolation
27 42
RF to IF Isolation
8 20
IP3 (Input)
30
IP2 (Input)
55
1 dB Gain Compression (Input)
20
*Unless otherwise noted, all measurements performed as downconverter, with high side LO and with IF= 100 MHz.
Max.
12
Units
GHz
GHz
GHz
dB
dB
dB
dB
dB
dBm
dBm
dBm
9 - 354
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1 page www.DataSheet4U.com
v02.0309
Outline Drawing
HMC663LC3
GaAs MMIC DOUBLE-BALANCED
HIGH IP3 MIXER, 6 - 12 GHz
9
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA.
2. LEAD AND GROUND PADDLE PLATING:
30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES (MILLIMETERS).
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, BLACK INK,
OR LASER MARK LOCATED APPROX. AS SHOWN.
6. PACKAGE WARP SHALL NOT EXCEED 0.05MM DATUM – C –
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
8. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1.
Pin Descriptions
Pin Number
1, 4, 5,
8 - 13, 16
2
Function
N/C
LO
3, 6, 15
GND
7 IF
14 RF
Description
Not Connected
This pin is AC coupled
and matched to 50 ohms.
These pins and package base must
be connected to RF/DC ground.
This pad is DC coupled. For applications not requiring opera-
tion to DC, this port should be DC blocked externally using a
series capacitor whose value has been chosen to pass the
necessary IF frequency range. For operation to DC, this pin
must not source or sink more than 2 mA of current or part
non-function and possible part failure will result.
This pin is AC coupled
and matched to 50 ohms.
Interface Schematic
9 - 358
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet HMC663LC3.PDF ] |
Número de pieza | Descripción | Fabricantes |
HMC663LC3 | Double-Balanced High IP3 SMT Mixer | Hittite Microwave Corporation |
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