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PDF EN5336QI Data sheet ( Hoja de datos )

Número de pieza EN5336QI
Descripción 3 Amp Buck Converter
Fabricantes Enpirion 
Logotipo Enpirion Logotipo



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EN5336QI
3A Voltage Mode Synchronous Buck PWM
DC-DC Converter with Integrated Inductor
External Feedback Output Voltage Programming
Description
The EN5336QI is a Power System on Silicon DC-
DC converter. It is specifically designed to meet
the precise voltage and fast transient
requirements of present and future high-
performance, low-power processor, DSP, FPGA,
memory boards and system level applications in
a distributed power architecture. Advanced circuit
techniques, ultra high switching frequency, and
very advanced, high-density, integrated circuit
and proprietary inductor technology deliver high-
quality, ultra compact, non-isolated DC-DC
conversion. Operating this converter requires
only small value input and output ceramic
capacitors, a soft-start capacitor and a resistor
divider for voltage feedback to set the output
voltage to the desired value.
Features
Integrated INDUCTOR, MOSFETS, Controller
Footprint 1/3rd that of competing solutions.
Minimum external components.
Up to 10W continuous output power.
5MHz operating frequency.
High efficiency, up to 93%.
VOUT accuracy 3% over line, load and temp.
Wide input voltage range of 2.375V to 5.5V.
External resistor divider for voltage feedback
and output voltage selection.
Output enable pin and Power OK signal.
Programmable soft-start time.
Programmable over-current protection.
Thermal shutdown, short circuit, and UVLO
RoHS compliant, MSL level 3, 260C reflow.
The Enpirion solution significantly helps in
system design and productivity by offering greatly
simplified board design, layout and
manufacturing requirements. In addition, a
reduction in the number of vendors required for
the complete power solution helps to enable an
overall system cost savings.
All Enpirion products are RoHS compliant and
lead-free manufacturing environment compatible.
Typical Application Circuit
Applications
Point of load regulation for low-power
processors, network processors, DSPs,
FPGAs, and ASICs
Notebook computers, servers, workstations
Broadband, networking, LAN/WAN, optical
Low voltage, distributed power architectures
with 2.5V, 3.3V or 5V rails
DSL, STB, DVR, DTV, iPC
Ripple sensitive applications
VIN
22µF
PVIN
AVIN
SS
15 nF
POK
AGND
VOUT
XOV
XFB
PGND
Figure 1. Simple Layout.
VOUT
47µF
Ordering Information
Part Number
EN5336QI-T
EN5336QI-E
Temp Rating
(°C) Package
-40 to +85
44-pin QFN T&R
QFN Evaluation Board
1 www.enpirion.com

1 page




EN5336QI pdf
Rev 1.2 October 2008
www.DataSheet4U.com
Recommended Operating Conditions
PARAMETER
Input Voltage Range
EN5336QI Operating Ambient Temperature
EN5336QI Operating Ambient Temperature
Operating Junction Temperature
SYMBOL
VIN
TA
TA
TJ
MIN
2.375
0
-40
-40
EN5336QI
MAX
5.5
+70
+85
+125
UNITS
V
°C
°C
°C
Thermal Characteristics
PARAMETER
SYMBOL
TYP
UNITS
Thermal Shutdown
TSD 150
°C
Thermal Shutdown Hysteresis
TSDH
15
°C
Thermal Resistance: Junction to Case (0 LFM) (Note 1)
θJC
3 °C/W
Thermal Resistance: Junction to Ambient (0 LFM)
θJA 25 °C/W
Note 1: Based on a four-layer board and proper thermal design in line with JEDEC EIJ/JESD 51 Standards.
Electrical Characteristics
NOTE: VIN=5.5V over operating temperature range unless otherwise noted. Typical values are at TA =
25°C.
PARAMETER SYMBOL
TEST CONDITIONS
Operating Input
Voltage
VIN
Feedback Pin Voltage
Drop out voltage
Shut-Down Supply
Current
VFB
VIN - VOUT
IS
Drop out voltage at full load
ENABLE=0V
Switching Frequency
VOUT
Output Voltage
Regulation
FOSC
VOUT
Over line, load and temperature
Maximum Continuous Output Current
Over Current Trip
Piont
IOCP
Enable Operation
Disable Threshold
VDISABLE
Max voltage to ensure the converter is
disabled
Enable Threshold
VENABLE
Enable Pin Current
IENABLE
Voltage Select Operation
2.375V VIN 5.5V
5.5V < VIN
VIN = 5.5V
VSX Logic Low
Threshold
VSX-Low Threshold voltage for Logic Low
VSX Logic High
Threshold
VSX-High
Threshold voltage for Logic High
(internally pulled high; can be left
floating to achieve logic high)
MIN
2.375
-3.0
1.8
2.0
1.8
TYP
0.75
100
5
4.5
50
MAX
5.5
600
UNITS
V
V
mV
µA
MHz
3.0 %
A
0.8 V
V
µA
0.8 V
VIN V
Enpirion 2008 all rights reserved, E&OE
5
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5 Page





EN5336QI arduino
Rev 1.2 October 2008
www.DataSheet4U.com
Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom of Package
EN5336QI
Lead frame offers many advantages in thermal performance, in reduced electrical lead resistance,
and in overall foot print. However, they do require some special considerations.
In the assembly process lead frame construction requires that, for mechanical support, some of the
lead-frame cantilevers be exposed at the point where wire-bond or internal passives are attached.
This results in several small pads being exposed on the bottom of the package.
Only the large thermal pad and the perimeter pads are to be mechanically or electrically connected to
the PC board. The PCB top layer under the EN5336QI should be clear of any metal except for the
large thermal pad. The “grayed-out” area in Figure 5 represents the area that should be clear of any
metal (traces, vias, or planes), on the top layer of the PCB. Figure 6 shows the recommended PCB
footprint for this device.
Figure 5. Lead-Frame exposed metal. Grey area highlights exposed metal that is not to be mechanically or
electrically connected to the PCB.
Enpirion 2008 all rights reserved, E&OE
11
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