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PDF PBRP113ZT Data sheet ( Hoja de datos )
| Número de pieza | PBRP113ZT | |
| Descripción | PNP 800 mA | |
| Fabricantes | NXP Semiconductors | |
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PBRP113ZT
PNP 800 mA, 40 V BISS RET; R1 = 1 kΩ, R2 = 10 kΩ
Rev. 01 — 16 January 2008
Product data sheet
1. Product profile
www.DataSheet4U.com
1.1 General description
800 mA PNP low VCEsat Breakthrough In Small Signal (BISS) Resistor-Equipped
Transistor (RET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic
package.
NPN complement: PBRN113ZT.
1.2 Features
I 800 mA repetitive peak output current
I High current gain hFE
I Built-in bias resistors
I Simplifies circuit design
I Low collector-emitter saturation voltage
VCEsat
I Reduces component count
I Reduces pick and place costs
I ±10 % resistor ratio tolerance
1.3 Applications
I Digital application in automotive and
industrial segments
I Medium current peripheral driver
I Switching loads
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter
Conditions
Min Typ Max Unit
VCEO
collector-emitter voltage
open base
- - −40 V
IO output current
[1][2] - - −600 mA
IORM
repetitive peak output current tp ≤ 1 ms;
[3] -
-
−800 mA
δ ≤ 0.33
R1 bias resistor 1 (input)
0.7 1
1.3 kΩ
R2/R1
bias resistor ratio
9 10 11
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
collector 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
1 page  
NXP Semiconductors
PBRP113ZT
PNP 800 mA, 40 V BISS RET; R1 = 1 kΩ, R2 = 10 kΩ
103
Zth(j-a)
(K/W)
102
10
www.DataSheet4U.com
δ=1
0.75
0.50
0.33
0.20
0.10
0.05
0.02
0.01
10
006aab001
10−1
10−5
10−4
10−3
10−2
10−1
1
10 102 103
tp (s)
FR4 PCB, mounting pad for collector 1 cm2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for
SOT23 (TO-236AB); typical values
103
Zth(j-a)
(K/W)
102
10
δ=1
0.75
0.50
0.33
0.20
0.10
0.05
0.02
0.01
10
006aab002
10−1
10−5
10−4
10−3
10−2
10−1
1
10 102 103
tp (s)
Ceramic PCB, Al2O3 standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for
SOT23 (TO-236AB); typical values
PBRP113ZT_1
Product data sheet
Rev. 01 — 16 January 2008
© NXP B.V. 2008. All rights reserved.
5 of 12
5 Page 
NXP Semiconductors
PBRP113ZT
PNP 800 mA, 40 V BISS RET; R1 = 1 kΩ, R2 = 10 kΩ
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
www.DataSheet4U.com
Production
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
PBRP113ZT_1
Product data sheet
Rev. 01 — 16 January 2008
© NXP B.V. 2008. All rights reserved.
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