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PDF ACAS0612 Data sheet ( Hoja de datos )

Número de pieza ACAS0612
Descripción Professional Thin Film Chip Resistor Array
Fabricantes Vishay Siliconix 
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No Preview Available ! ACAS0612 Hoja de datos, Descripción, Manual

ACAC 0612, ACAS 0612 - Professional
Vishay Beyschlag
Professional Thin Film Chip Resistor Array
www.DataSheet4U.com
FEATURES
Advanced thin film technology
Two pairs or four equal resistor values
TCR down to ± 25 ppm/K
Tolerance down to ± 0.5 %
Pure Sn termination on Ni barrier layer
RoHS compliant component, compatible with lead (Pb)-free
and lead containing soldering processes
ACAC 0612 (concave terminations) and ACAS 0612 (convex
terminations) thin chip resistor arrays combine the proven
reliability of professional thin film chip resistor products with
the advantages of chip resistor arrays. A small package
enables the design of high density circuits in combination
with reduction of assembly costs. Four equal resistor values
or two pairs are available.
APPLICATIONS
Voltage divider
Feedback circuits
Signal conditioning
Bus terminations
TECHNICAL SPECIFICATIONS
DESCRIPTION
ACAC 0612, ACAS 0612
EIA size
0612
Metric size
RR1632M
Configuration, isolated
4 x 0603
Design:
All Equal
AE
Two Pairs
Resistance values
Absolute tolerance (2)
Absolute temperature coefficient (2)
Max. resistance ratio Rmin./Rmax.
Rated dissipation: P70 (4)
Element
TP
47 Ω to 221 kΩ (1)
± 1 %; ± 0.5 %
± 50 ppm/K; ± 25 ppm/K
1:10 (3)
0.1 W
Package, 4 x 0603
0.3 W
Operating voltage
Film temperature
75 V
125 °C
Insulation voltage (Uins) against ambient and between isolated
resistors, continuous
75 V
Notes
(1) Resistance values to be selected from E24, E48 and E96
(2) For TCR tracking, tolerance matching and tighter absolute tolerance please refer to data sheet “Precision Thin Film Chip Resistor Array“
available on our web site at www.vishay.com
(3) Higher resistance ratio is available on request
(4) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat-flow support of the printed
circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high
level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board
materials may be required to maintain the reliability of the assembly.
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
www.vishay.com
268
For technical questions, contact: [email protected]
Document Number: 28754
Revision: 11-Sep-08

1 page




ACAS0612 pdf
ACAC 0612, ACAS 0612 - Professional
Vishay Beyschlag Professional Thin Film Chip Resistor Array
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
EN 60115-1, Generic specification (includes tests)
EN 140400, Sectional specification (includes schedule for
qualification approval)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068*
and under standard atmospheric conditions according to
IEC 60068-1*, 5.3. Climatic category LCT/UCT/56 (rated
www.DataSheteemt4Upe.croamture range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
In the following table only the tests and requirements are
listed with reference to the relevant clauses of EN 60115-1
and IEC 60068-2*; a short description of the test procedure
is also given.
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2*
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS (1)
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
4.5
4.8.4.2
4.25.1
4.25.3
4.24
4.13
4.19
4.18.2
4.17.2
4.32
4.33
4.7
-
-
-
-
78 (Cab)
-
14 (Na)
58 (Td)
58 (Td)
21 (Ue3)
21 (Ue1)
-
Resistance
Temperature coefficient
Endurance
Endurance at upper
category temperature
Damp heat,
steady state
Short time overload (2)
Rapid change of
temperature
Resistance to soldering
heat
Solderability
Shear (adhesion)
Substrate bending
Voltage proof
ACAC 0612, ACAS 0612
Climatic category
(LCT/UCT/duration)
-
At 20/LCT/ 20 °C and
20/UCT/20 °C
U = P70 x R or U = Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
125 °C; 1000 h
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
U = 2.5 x P70 x R or
U = 2 x Umax.; 5 s
30 min at LCT and
30 min at UCT;
5 cycles
Reflow method 2
(IR/forced gas convention);
(260 ± 5) °C;
(10 ± 1) s
Solder bath method;
SnPb; non-activated flux
accelerated ageing 4 h/155 °C
(215 ± 3) °C; (3 ± 0.3) s
Solder bath method;
SnAgCu; non-activated flux
accelerated ageing 4 h/155 °C
(235 ± 3) °C; (2 ± 0.2) s
45 N
Depth 2 mm, 3 times
Urms = Uins
60 ± 5 s; against ambient,
between adjacent resistors
47 Ω to 221 kΩ
- 55 °C/+ 125 °C/56 days
± 1 %; ± 0.5 %; ± 0.25 %
± 50 ppm/K; ± 25 ppm/K
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω)
no visible damage
± (0.1 % R + 0.01 Ω)
no visible damage
± (0.25 % R + 0.01 Ω)
no visible damage
Good tinning (95 % covered);
no visible damage
No visible damage
± (0.1 % R + 0.01 Ω)
no visible damage;
no open circuit in bent position
No flashover or breakdown
Notes
(1) Figures are given for equal values
(2) For a single element
• The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents
www.vishay.com
272
For technical questions, contact: [email protected]
Document Number: 28754
Revision: 11-Sep-08

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