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PDF CIP21T901NE Data sheet ( Hoja de datos )
| Número de pieza | CIP21T901NE | |
| Descripción | Splitter | |
| Fabricantes | ETC | |
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Hay una vista previa y un enlace de descarga de CIP21T901NE (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
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Splitter
Splitter is used for dividing local power in a mobile phone . It is positioned ahead of
VCO output and sends the local power to Rx/Tx parts separately. Output signals
have mutually the same phase and amplitude.
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General Features
-Available in the 700MHz to 1.9GHz frequency range.
- Low loss and high isolation
- Ultra-small size and lightweight SMDs.
- Available in tape and reel packings for automatic mounting.
- Operating temperature: -35℃ to +85℃
- Recommended Matching Capacitor
: 3pF for CIP21T701NE : 2pF for CIP21(or 31)T901NE
- Reflow soldering available.
: 1pF for CIP21(or 31)T182NE
Applications
- Dividing local power in a mobile phone.
Part Numbering
●2 SERIES
CI P 21 T 901 N
●1 ●2 ●3 ●4 ●5 ●6
●1 Abbreviation of Splitter
●2 Series
●3 Dimension
●4 Material
●5 Frequency Band for Application
●6 Thickness Option
E
●7
CODE
P
DESCRIPTION OF CODE
CHIP SPLITTER
1 page  
RELIABILITY TEST CONDITION
NO ITEM
CONDITION
SPECIFICATION
1
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THERMAL SHOCK
TEMP. CYCLE OF THE FOLLOWING BE
SUBJECT FOR 100CYCLES.
-40℃,30min ↔ +85℃,30min
ELECTRICAL CHARACTERISTICS
SHALL BE SATISFIED.
2
HUMIDITY
RESISTANCE
+40±3℃, RELATIVE HUMIDITY
90~95% FOR 1000hours.
ELECTRICAL CHARACTERISTICS
SHALL BE SATISFIED.
3
HIGH TEMPERATURE
RESISTANCE
+125±3℃ FOR 1000hours.
ELECTRICAL CHARACTERISTICS
SHALL BE SATISFIED.
4
LOW TEMPERATURE
RESISTANCE
-40±3℃ FOR 1000hours.
ELECTRICAL CHARACTERISTICS
SHALL BE SATISFIED.
5
SOLDERABILITY
Soldering temp.: 245±5℃
Immersion time: 4±1sec.
At least 90% of the termination
on each should be covered with
solder.
Preheat : 100~130℃, 60~120sec
Peak Temperature : 250℃ max.
ELECTRICAL CHARACTERISTICS
6
RESISTANCE TO
SOLDERING HEAT
Specimens are soldered twice with the
above condition then kept in room
temperature and humidity for 24 hours
SHALL BE SATISFIED.
WITHOUT DISTINCT DEFORMATION
before measurements.
IN APPEARANCE.
Temperature profile is as below
※ Temperature profile
TEMP
P rehea ti ng
Soldering Temp
△T ≤1 50
Preheating Temp
Soldering
Coo l i ng
250℃
30~50 sec
220℃
60≥ 60~120
6≥
TIME (sec)
5 Page 
NOTICE
● Report before change
If it is required to change the specifications, materials or manufacturing methods of this specified
Baluns, we shall inform on written statement with its quality and reliability data before changes may
occur.
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● Packaging
Package includes label with below item and outgoing inspection data on customer's request.
- Part No.& Lot No.
- Quantity
- Name and logo of manufacturer
● Restriction of environmental destructive material
Baluns specified on this specification do not use any of under stated materials.
Cd, Hg, As, Br and its chemical composite, PCB and asbestos.
PBBS
PBBOs
PBDO
PBDE
PBB
● Usage of destructive materials to ozonosphere
CBaluns specified on this specification do not use any of under stated ODS materials on its
manufacturing stages.
Freon
Haron
1-1-1 TCE
CCl4
HCFC
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet CIP21T901NE.PDF ] | |
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