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PDF ACPF-7002 Data sheet ( Hoja de datos )
| Número de pieza | ACPF-7002 | |
| Descripción | High Rejection Tx Filter | |
| Fabricantes | Agilent | |
| Logotipo |  |
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Agilent ACPF-7002
High Rejection Tx Filter
for US PCS Band
Data Sheet
Features
• High rejection from a single filter
With no switches required.
• Passband: 1850-1910 MHz
33 dB min Attenuation,
1930-1990 MHz
2.5 dB Typical Insertion Loss
• Space saving solution
Small footprint:
1.6 x 2.0-mm solution
Low profile package:
0.9 mm high (Typ)
1.0 mm (MAX)
Applications
• US PCS band handsets
• Wireless Data terminals
General Description
The ACPF- 7002 is a high
rejection full band transmit
filter designed for US PCS
handsets. Its performance rivals
splitband surface acoustic wave
(SAW) transmit filters. Since a
single filter provides the
rejection, no switches are
required, saving board space
and external components,
eliminating switch loss, and
reducing programming
complexity.
The ACPF- 7002 FBAR transmit
filter utilizes Agilent's Microcap
bonded- wafer chip scale
packaging technology. This
process allows the ultra small
filters to be assembled into a
Molded Chip on Board (MCOB)
module.
In typical cellular phone
architectures, the transmit filter
fits between the driver amplifier
and the Power Amplifier. The
ACPF- 7002 FBAR filter reduces
the noise in the Rx band being
amplified by the transmit chain,
enhancing receiver sensitivity.
High rejection keeps unwanted
signals out of the receive path.
Agilent’s thin- Film Bulk
Acoustic Resonator (FBAR)
technology makes possible high-
Q filters at a fraction their
usual size.
1 page  
0.60 ± 0.15
1
1.25 MAX
0.35 ± 0.15
8X
2
43
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2.0
Shaded Region Grounded
Pin 1
Marking
: Pin 1 Location
A : Work Week
B,C,D : Lot Number
Figure 10. Detailed Bottom, Side and Top view of Package
Note:
Dimensions in mm
Layer 1
0.61 0.70
0.61
0.30
4 OUT
3
IN
12
Via to layer 2
0.33 1.92
This region is Soldermask covering ground
Region (4) & (2) is exposed ground for soldering filter pads
Note:
Dimensions in mm
Figure 11. Suggested PCB layers, viewed from top
Layer 2 (GROUND layer)
0.3
Metal voided
To decrease
Capacitance at
Input Port
0.3
0.3
Metal voided
To decrease
Capacitance at
output Port
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet ACPF-7002.PDF ] | |
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