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PDF DEI1066 Data sheet ( Hoja de datos )
| Número de pieza | DEI1066 | |
| Descripción | Octal GND / Open Input / Serial Output Interface IC | |
| Fabricantes | Device Engineering | |
| Logotipo |  |
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Device
Engineering
Incorporated
385 East Alamo Drive
Chandler, AZ 85225
Phone: (480) 303-0822
Fax: (480) 303-0824
E-mail: [email protected]
DEI1066
OCTAL GND/OPEN INPUT, SERIAL
OUTPUT INTERFACE IC
FEATURES
• Eight GND/OPEN discrete inputs
o Meet electrical requirements for ABD0100 GND/OPEN discrete input.
o Hysteresis provides noise immunity
o Internal pull up resistor with 1mA source current to prevent dry relay contacts.
o Internal isolation diode
o Inputs protected from Lightning Induced Transients per DO160D, Section 22, Cat A3 and B3.
• 3-wire serial interface (/CS, CLK, DO)
o Direct interface to Serial Peripheral Interface (SPI) port.
o TTL/CMOS compatible inputs and Tristate output
o 10MHz Data Rate
o Serial input to expand Shift Register
• Logic Supply Voltage (VCC):
3.3V or 5V
• Analog Supply Voltage (VDD):
5V to 18V
• 16L NB SOIC package
• 16L Ceramic SO Package
PIN ASSIGNMENTS
DIN1
DIN2
DIN3
DIN4
DIN5
DIN6
DIN7
DIN8
1
DEI1066
16 VDD
GND
VCC
GND
SDIN
/CS
SCLK
DOUT
Figure 1 DEI1066 Pin Assignment (16 Lead NB SOIC)
©2006 Device Engineering Inc
Page 1 of 11
DS-MW-01066-01 Rev E
08/25/2006
1 page  
www.DataSheet4U.com
Lightning Protection
DINn inputs are designed to survive lightning induced transients as defined by RTCA DO160D, Section 22, Cat A3 and B3,
Waveforms 3, 4, and 5A, Level 3. See waveforms below.
V/I
50%
0
25% to 75%
of Largest Peak
t
F = 1MHZ and 10MHZ
Figure 7 Voltage / Current Waveform 3
Waveform Source Impedance characteristics:
• Waveform 3 Voc/Isc = 600V / 24A => 25 Ohms
• Waveform 4 Voc/Isc = 300 V / 60 A => 5 Ohms
• Waveform 5A Voc / Isc = 300V / 300A => 1 Ohm
V
Peak
50%
T1 = 6.4uS
T2 = 70uS
0
T1
t
T2
Figure 8 Voltage Waveform 4
V/I
Peak
T1=40uS
T2=120uS
50%
0
T1
t
T2
Figure 9 Current/Voltage Waveform 5A
©2006 Device Engineering Inc
Page 5 of 11
DS-MW-01066-01 Rev E
08/25/2006
5 Page 
www.DataSheet4U.com
16 Lead Ceramic Small Outline Package (CSOP)
Theta ja:
Theta jc:
Moisture Sensitivity Level:
122 C/W Device mounted on 2 layer PCB
5 C/W
Hermetic
Figure 12 16 Lead CSOP Outline Drawing
ORDERING INFORMATION
Part Number
DEI1066-SES
DEI1066-SMS
DEI1066-SMB
DEI1066-WMS
DEI1066-WMB
Marking
DEI1066-SES
DEI1066-SMS
DEI1066-SMB
DEI1066-WMS
DEI1066-WMB
Table 7
Package
16 SOIC
16 SOIC
16 SOIC
16 CSOP
16 CSOP
Burn In
No
No
96hr / +125 ºC
No
96hr / +125 ºC
Temperature
-55 / +85 ºC
-55 / +125 ºC
-55 / +125 ºC
-55 / +125 ºC
-55 / +125 ºC
DEI reserves the right to make changes to any products or specifications herein. DEI makes no warranty, representation, or
guarantee regarding suitability of its products for any particular purpose.
©2006 Device Engineering Inc
Page 11 of 11
DS-MW-01066-01 Rev E
08/25/2006
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet DEI1066.PDF ] | |
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