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DEI1074 Schematic ( PDF Datasheet ) - Device Engineering

Teilenummer DEI1074
Beschreibung (DEI1073 - DEI1075) Arinc 429 Line Driver
Hersteller Device Engineering
Logo Device Engineering Logo 




Gesamt 8 Seiten
DEI1074 Datasheet, Funktion
www.DataSheet4U.com
Device
Engineering
Incorporated
385 East Alamo Drive
Chandler, AZ 85225
Phone: (480) 303-0822
Fax: (480) 303-0824
DEI1073, DEI1074, DEI1075
ARINC 429 LINE DRIVER WITH RATE
SELECT AND TRI-STATE
FEATURES
TTL/CMOS TO ARINC 429 Line Driver.
Rate control input set Hi (100KBS) or Lo (12.5KBS) speed slew rates.
Operates from ±9.5V to ±16.5V power supply.
Drives full ARINC load.
Output resistor options: 0, 10 or 37.5 Ohms.
Tristate Outputs
Thermally enhanced 8 lead SOIC package.
Outputs Short Circuit Tolerant
GENERAL DESCRIPTION
The DEI1073 family of 8 pin BiCMOS integrated circuits are line drivers designed to directly drive the ARINC 429 avionics
serial digital data bus. The device converts TTL/CMOS serial input data to the tri-level RZ bipolar differential modulation
format of the ARINC bus. The outputs are tri-state capable. A TTL/CMOS control input selects the output slew rate for HI
(100KBS) and LOW (12.5KBS) speed operation. No external timing capacitors are required.
The DEI1073 has internal 37.5 Ohm output resistors, the DEI1074 has 10 Ohm resistors, and the DEI1075 has none. The 10
and 0 Ohm options require external series resistors which are typically used to implement a transient voltage protection
network.
HI/LO 1
TTLIN0 2
TTLIN1 3
GND 4
8 V+
7 429OUTB
6 429OUTA
5 V-
Note:
Heatsink pad is electrically Isolated.
Table 1 PIN DESCRIPTION
PIN NAME
DESCRIPTION
1
HI/LO
LOGIC INPUT. Slew rate control. 1 = Hi speed. 0
= Low speed.
2
TTLIN0
LOGIC INPUT. Serial digital data input 0.
3
TTLIN1
LOGIC INPUT. Serial digital data input 1.
4
GND
POWER INPUT. Ground.
5 V- POWER INPUT. –9.5 to –16.5 VDC
6
429OUTA
429 OUTPUT. ARINC 429 format serial digital data
output A.
7
429OUTB
429 OUTPUT. ARINC 429 format serial digital data
output B.
8 V+ POWER INPUT. +9.5 to +16.5 VDC.
©2004 Device Engineering Inc
Page 1 of 8
DS-MW-01073-01 Rev C
05/31/2005






DEI1074 Datasheet, Funktion
www.DataSheet4U.com
PACKAGE DESCRIPTION
TOP VIEW
D
8 Lead EDQUAD SOIC
BOTTOM VIEW
2.70±.10
R0.50(4X)
E1 E
1.70±.10
A A2
ddd M C
b
7° TYP.
DETAIL X
A1 SEATING PLANE
e
SIDE VIEW
-C-
7° TYP.
ccc C
LEAD COPLANARITY
STAND-OFF
EXPOSED
HEATSINK
EXPOSED
HEATSINK
4.67±.040
7° TYP.
7° TYP.
E1
NOTES:
1) ALL DIMENSIONS IN MILLIMETER.
2) REFERENCE JEDEC SPEC: MS-012
BETWEEN "SEATING PLANE" AND THE
PACKAGE WHICH EVER IS LOWER.
.203mm (0.008") THICK.
DIMS.
A
A1
A2
D
E
E1
L
ccc
ddd
e
b
0
R
R1
TOLS.
N
MAX.
±.05
±.10
±.10
±.20
±.10
±.15
MAX.
MAX.
BASIC
±.05
MAX.
TYP.
8
1.60
0.05
1.40
4.90
6.00
3.90
0.60
0.10
0.10
1.27
0.43
0° ~ 8D
0.20
0.13
SEATING PLANE
0.310 0.170
Solder Stencil:
Approximately size of exposed pad,
depending on solder process
Exposed pad outline .106 x .070
Solder Mask .136 x .100
0.070
Copper Land with Vias to
internal plane. Large as
possible.
0.050
0.024
Suggested Land Pattern (Dimensions in inches)
SYMBOL
Table 7 8 Lead EDQUAD SOIC Characteristics
DESCRIPTION
VALUE
UNITS
Thetaja Junction to Ambient.
59 °C/W
4 layer board with 2 internal power planes.
Exposed pad soldered to PCB heat spreader
land.
MSL JEDEC Moisture Sensitivity Level
2-
Peak Body Temperature
235 °C
©2004 Device Engineering Inc
Page 6 of 8
DS-MW-01073-01 Rev C
05/31/2005

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