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PDF EClamp2455P Data sheet ( Hoja de datos )

Número de pieza EClamp2455P
Descripción ESD/EMI Protection
Fabricantes Semtech Corporation 
Logotipo Semtech Corporation Logotipo



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PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2455P is combination EMI filter and line
termination device with integrated TVS diodes for use on
SIM Card interfaces on cellular phones and other por-
table electronics. This state-of-the-art device utilizes
solid-state silicon-avalanche technology for superior
clamping performance and DC electrical characteristics.
The device consists of three circuits that include series
impedance matching resistors for proper termination of
the SIM card interface. Termination resistor value of
100 Ohms is included on the RST and Data lines and 47
Ohms on the CLK line. TVS diodes are also included on
each line for ESD protection in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4. An additional TVS diode connection is
included for protection of the voltage (Vcc) bus.
The EClamp2455P is in a 8-pin, RoHS/WEEE compliant,
SLP2116P8 package. It measures 2.1 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPdAu. The small
package makes it ideal for use in portable electronics
such as cell phones and digital still cameras.
Features
EClamp2455P
ESD/EMI Protection
for SIM Card
PRELIMINARY
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ TVS working voltage: 5V
‹ Termination Resistors: 100 Ohms & 47 Ohms
‹ Capacitance: 20pF (Typical at VR = 0V)
‹ Protection and filtering for four lines
‹ Solid-state technology
Mechanical Characteristics
‹ SLP2116P8 8-pin package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
‹ Lead Pitch: 0.5mm
‹ Lead finish: NiPdAu
‹ Marking: Marking Code
‹ Packaging: Tape and Reel per EIA 481
Applications
‹ SIM Card
‹ Cell Phone
‹ PDAs and Smartphones
Pin Configuration
Package Configuration
RST Out 1
CLK Out
Data Out
NC 4
8 RST In
CLK In
Gnd
Data In
5 Vcc
2.10
12
1.60
0.50 BSC
0.58
Pin Identification and Configuration
(Top Side View)
Revision 03/27/2007
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com

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EClamp2455P pdf
PROTECTION PRODUCTS
Device Connection
The EClamp2455P designed with ease of layout in
mind. The package has flow through design which
allows the designer to route the signals straight in and
out between the SIM port connector and the SIM
controller. The device is in a 8-pin SLP package.
Electrical connection is made to the 8 pins located at
the bottom of the device. A center tab serves as the
ground connection. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces.
EClamp2455P
PRELIMINARY
Figure 1 - Pin Identification and Configuration
(Top Side View)
RST Out 1
8 RST In
CLK Out
Data Out
CLK In
Gnd
Data In
NC 4
5 Vcc
RST OUT
CLK OUT
1
8
DATA OUT
Gnd
45
RST In
CLK IN
DATA IN
Vcc
EClamp2455P
SIM Card
Connector
Reset
Clock
Data I/O
5V/3.3V/1.8V
© 2007 Semtech Corp.
Figure 2 - SIM Protection
5
www.semtech.com

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