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PDF DS1350AB Data sheet ( Hoja de datos )
| Número de pieza | DS1350AB | |
| Descripción | 4096k Nonvolatile SRAM | |
| Fabricantes | Dallas Semiconductor | |
| Logotipo |  |
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DS1350Y/AB
4096k Nonvolatile SRAM
with Battery Monitor
FEATURES
10 years minimum data retention in the
absence of external power
Data is automatically protected during power loss
Power supply monitor resets processor when
VCC power loss occurs and holds processor in
reset during VCC ramp-up
Battery monitor checks remaining capacity
daily
Read and write access times as fast as 70 ns
Unlimited write cycle endurance
Typical standby current 50 µA
Upgrade for 512k x 8 SRAM, EEPROM or
Flash
Lithium battery is electrically disconnected to
retain freshness until power is applied for the
first time
Full ±10% VCC operating range (DS1350Y)
or optional ±5% VCC operating range
(DS1350AB)
Optional industrial temperature range of
-40°C to +85°C, designated IND
New PowerCap Module (PCM) package
- Directly surface-mountable module
- Replaceable snap-on PowerCap provides
lithium backup battery
- Standardized pinout for all nonvolatile
SRAM products
- Detachment feature on PowerCap allows
easy removal using a regular screwdriver
PIN ASSIGNMENT
BW
A15
A16
RST
VCC
WE
OE
CE
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND VBAT
15
16
17
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
34-Pin POWERCAP MODULE (PCM)
(USES DS9034PC POWERCAP)
A18
A17
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
PIN DESCRIPTION
A0 - A18
- Address Inputs
DQ0 - DQ7
- Data In/Data Out
CE - Chip Enable
WE - Write Enable
OE - Output Enable
RST - Reset Output
BW - Battery Warning
VCC
GND
- Power (+5V)
- Ground
NC - No Connect
DESCRIPTION
The DS1350 4096k Nonvolatile SRAMs are 4,194,304-bit, fully static, nonvolatile SRAMs organized as
524,288 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control circuitry
which constantly monitors VCC for an out-of-tolerance condition. When such a condition occurs, the
lithium energy source is automatically switched on and write protection is unconditionally enabled to
prevent data corruption. Additionally, the DS1350 devices have dedicated circuitry for monitoring the
status of VCC and the status of the internal lithium battery. DS1350 devices in the PowerCap Module
package are directly surface mountable and are normally paired with a DS9034PC PowerCap to form a
complete Nonvolatile SRAM module. The devices can be used in place of 512k x 8 SRAM, EEPROM or
Flash components.
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111999
1 page  
AC ELECTRICAL
CHARACTERISTICS
PARAMETER
Read Cycle Time
Access Time
OE to Output Valid
CE to Output Valid
OE or CE to Output Active
Output High Z from Deselection
Output Hold from Address
Change
Write Cycle Time
Write Pulse Width
Address Setup Time
Write Recovery Time
Output High Z from WE
Output Active from WE
Data Setup Time
Data Hold Time
DS1350Y/AB
(VCC=5V ±=5% for DS1350AB)
(tA: See Note 10) (VCC=5V ±=10% for DS1350Y)
DS1350AB-70 DS1350AB-100
DS1350Y-70 DS1330Y-100
SYMBOL MIN MAX MIN MAX UNITS NOTES
tRC 70
100
ns
tACC 70 100 ns
tOE 35 50 ns
tCO 70 100 ns
tCOE
5
5
ns 5
tOD
25
35 ns
5
tOH 5
5
ns
tWC 70
100
ns
tWP 55
75
ns 3
tAW 0
0
ns
tWR1
tWR2
5
12
5
12
ns 12
13
tODW
25
35 ns
5
tOEW
5
5
ns 5
tDS 30
40
ns 4
tDH1
tDH2
0
7
0
7
ns 12
13
READ CYCLE
SEE NOTE 1
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5 Page 
DS1350Y/AB
DS1350Y/AB NONVOLATILE SRAM, 34-PIN POWERCAP MODULE WITH
POWERCAP
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.955
0.240
0.052
0.048
0.015
0.020
INCHES
NOM
0.925
0.960
0.245
0.055
0.050
0.020
0.025
MAX
0.930
0.965
0.250
0.058
0.052
0.025
0.030
ASSEMBLY AND USE
Reflow soldering
Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented label-side up (live-bug).
Hand soldering and touch-up
Do not touch soldering iron to leads for more than 3 seconds. To solder, apply flux to the pad, heat the
lead frame pad and apply solder. To remove part, apply flux, heat pad until solder reflows, and use a
solder wick.
LPM replacement in a socket
To replace a Low Profile Module in a 68-pin PLCC socket, attach a DS9034PC PowerCap to a module
base then insert the complete module into the socket one row of leads at a time, pushing only on the
corners of the cap. Never apply force to the center of the device. To remove from a socket, use a PLCC
extraction tool and ensure that it does not hit or damage any of the module IC components. Do not use
any other tool for extraction.
11 of 12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet DS1350AB.PDF ] | |
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