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Teilenummer | GP1A73AJ000F |
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Beschreibung | Snap-in type Transmissive Photointerrupter | |
Hersteller | Sharp Electrionic | |
Logo | ||
Gesamt 10 Seiten www.DataSheet4U.com
GP1A73AJ000F
GP1A73AJ000F
Gap : 5mm Slit : 0.5mm
*OPIC Output,
Snap-in type
Transmissive Photointerrupter with
Connector
■ Description
GP1A73AJ000F is a standard, OPIC output, transmis-
sive photointerrupter with opposing emitter and detector
in a case, providing non-contact sensing. For this fam-
ily of devices, the emitter and detector are inserted in a
case, and a 3-pin connector is included to allow remote-
mount or off-board designs.
■ Features
1. Transmissive with OPIC output
2. Highlights :
• Special position hooks compatible with 3 different
plate thicknesses (1.0, 1.2, 1.6mm)
• Hinged snap insertion
3. Key Parameters :
• Gap Width : 5mm
• Slit Width (detector side): 0.5mm
• Package : 17×12.8×8mm (without connector and
hooks)
• Connector : Tyco Electronics AMP K.K. (PN : 292133-3)
or SUMIKO TEC CO., LTD.
(PN : GH4A003P000ZA)
• Output Type : High when the object is present with
Pullup Resistor.
4. Lead free and RoHS directive compliant
■ Agency approvals/Compliance
1. Compliant with RoHS directive
■ Applications
1. General purpose detection of object presence or mo-
tion.
2. Example : PPC, FAX, Printer
* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-
processing
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D3-A04601EN
1 Date Oct. 3. 2005
© SHARP Corporation
GP1A73AJ000F
■ Design Considerations
● Design guide
1) Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) In order to stabilize power supply line, connect aby-pass capacitor of more than 0.01μF between VCC and
GND near the device.
3) When the sensor is connected with long wire, noise might be on the signal from the sensor while it is
going through the wire. To avoid this problem, please evaluate the sensor under actual usage condition to
make sure that the system works fine.
4) Position of opaque board
Opaque board shall be installed at place 4mm or more from the top of elements.
(Example)
4mm or more
This product is not designed against irradiation and incorporates non-coherent IRED.
● Parts
This product is assembled using the below parts.
• Photodetector (qty. : 1) [Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit]
Category
Material
Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm)
Response time (μs)
Photodiode
Silicon (Si)
900
400 to 1 200
10
• Photo emitter (qty. : 1)
Category
Infrared emitting diode
(non-coherent)
Material
Gallium arsenide (GaAs)
• Material
Case
Black polycarbonate resin
(UL94V-2)
Lead frame
42Alloys
(There is no plating)
Maximum light emitting
wavelength (nm)
940
I/O Frequency (MHz)
0.3
Connector terminal finish
Sn plating (PN : 292133-3)
SnCu plating (PN : GH4A003P000ZA)
• Others
Laser generator is not used.
Sheet No.: D3-A04601EN
6
6 Page | ||
Seiten | Gesamt 10 Seiten | |
PDF Download | [ GP1A73AJ000F Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
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