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PDF GBJ15A Data sheet ( Hoja de datos )
| Número de pieza | GBJ15A | |
| Descripción | (GBJ15A - GBJ15M) 15A GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER | |
| Fabricantes | Won-Top Electronics | |
| Logotipo |  |
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WTE
POWER SEMICONDUCTORS
GBJ15A – GBJ15M Pb
15A GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER
Features
! Glass Passivated Die Construction
! Low Forward Voltage Drop
! High Current Capability
! High Reliability
! High Surge Current Capability
! Ideal for Printed Circuit Boards
! Recognized File # E157705
G
C
H
J
Mechanical Data
! Case: GBJ-6, Molded Plastic
! Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
! Polarity: As Marked on Body
! Weight: 7.0 grams (approx.)
! Mounting Position: Any
! Mounting Torque: 10 cm-kg (8.8 in-lbs) Max.
! Lead Free: For RoHS / Lead Free Version,
Add “-LF” Suffix to Part Number, See Page 4
A
+ ~ ~-
B
K
PRR
D
E
M
N
SG
T
L
GBJ-6
Dim Min
Max
A 29.7 30.3
B 19.7 20.3
C—
5.0
D 17.0 18.0
E 3.8
4.2
G 3.1Ø 3.4Ø
H 2.3
2.7
J 0.9 1.1
K 1.8
2.2
L 0.6 0.8
M 4.4
4.8
N 3.4
3.8
P 9.8 10.2
R 7.3
7.7
S 10.8 11.2
T 2.3 2.7
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current @TC = 100°C
(Note 1)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
Forward Voltage per diode
@IF = 7.5A
Peak Reverse Current
At Rated DC Blocking Voltage
@TA = 25°C
@TA = 125°C
Typical Thermal Resistance per leg (Note 2)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
Symbol
VRRM
VRWM
VR
VR(RMS)
IO
IFSM
VFM
IR
RJA
RJC
Tj, TSTG
GBJ
15A
50
35
GBJ
15B
100
70
GBJ
15D
GBJ
15G
GBJ
15J
200 400 600
140 280 420
15
240
1.05
10
250
22
1.5
-55 to +150
GBJ
15K
800
560
GBJ
15M
Unit
1000 V
700 V
A
A
V
µA
°C/W
°C/W
°C
Note: 1. Device mounted on 300 x 300 x 1.6mm thick Cu plate heatsink.
2. Device mounted on P.C.B. without heatsink.
GBJ15A – GBJ15M
1 of 4
© 2006 Won-Top Electronics
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet GBJ15A.PDF ] | |
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