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RF6263 Schematic ( PDF Datasheet ) - RF Micro Devices

Teilenummer RF6263
Beschreibung LINEAR POWER AMPLIFIER MODULE
Hersteller RF Micro Devices
Logo RF Micro Devices Logo 




Gesamt 8 Seiten
RF6263 Datasheet, Funktion
www.DataSheet4U.com
RF6263
3V 900MHZ LINEAR POWER
AMPLIFIER MODULE
RoHS Compliant & Pb-Free Product
Package Style: QFN, 16-Pin, 3x3
Features
„ Input Internally
Matched @ 50 Ω
„ Output Internally Matched
„ 23% Linear Efficiency @
19 dBm
„ 40% Linear Efficiency @
28 dBm
„ -50dBc ACPR @ 885kHz
„ 18mA Idle Current in LPM
Applications
„ 3V CDMA/AMPS Cellular
Handset
„ 3V CDMA2000/1XRTT Cellu-
lar Handset
„ 3V CDMA2000/1X-EV-DO US-
Cellular Handset
„ Spread-Spectrum System
16 15 14 13
NC 1
VREG 2
VMODE 3
RF IN 4
Bias
12 RF OUT
11 VCC2
10 VCC2
9 VCC2
5678
Functional Block Diagram
Product Description
The RF6263 is a high-power, high-efficiency linear amplifier module spe-
cifically designed for 3V handheld systems. The device is manufactured
on an advanced third generation GaAs HBT process, and was designed for
use as the final RF amplifier in 3V IS-95/CDMA2000-1X/
AMPS handheld digital cellular equipment, spread-spectrum systems, and
other applications in the 824MHz to 849MHz band. The RF6263 has a
digital control pin which when enabled will allow the amplifier to operate
up to 19dBm output power with reduced current consumption. The low
power mode current consumption can be reduced by more than 50% that
of a standard power amplifier. The RF6263 is assembled in a 16-pin,
3mmx3mm, QFN package.
Ordering Information
RF6263
3V 900MHz Linear Power Amplifier Module
RF6263PCBA-41X Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
9GaAs HBT
SiGe BiCMOS
GaAs pHEMT
GaN HEMT
GaAs MESFET
Si BiCMOS
Si CMOS
InGaP HBT
SiGe HBT
Si BJT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Rev A0 DS070622
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 8






RF6263 Datasheet, Funktion
RF6263
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for PFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 0.64 x 1.28 (mm)
D = 1.50 (mm) Sq.
Dimensions in mm.
1.50 Typ.
0.50 Typ.
Pin 16
BBBB
Pin 1
Pin 12
0.50 Typ.
A
A
A
0.75 Typ. 1.00 Typ.
D
AC
0.55 Typ.
A
0.55 Typ.
BBBB
Pin 8
0.75 Typ.
Figure 1. PCB Metal Land Pattern (Top View)
6 of 8
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Rev A0 DS070622

6 Page







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