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RF6100-1 Schematic ( PDF Datasheet ) - RF Micro Devices

Teilenummer RF6100-1
Beschreibung LINEAR POWER AMPLIFIER MODULE
Hersteller RF Micro Devices
Logo RF Micro Devices Logo 




Gesamt 6 Seiten
RF6100-1 Datasheet, Funktion
www.DataSheet4U.com
RF6100-1
0
RoHS Compliant & Pb-Free Product
Typical Applications
3V 900MHZ LINEAR POWER
AMPLIFIER MODULE
• 3V CDMA/AMPS Cellular Handset
• Spread-Spectrum System
• 3V CDMA20001/X Cellular Handset
Product Description
The RF6100-1 is a high-power, high-efficiency linear
amplifier module specifically designed for 3V handheld
systems. The device is manufactured on an advanced
third generation GaAs HBT process, and was designed
for use as the final RF amplifier in 3V IS-95/CDMA 2000
1X/AMPS handheld digital cellular equipment, spread-
spectrum systems, and other applications in the 824MHz
to 849MHz band. The RF6100-1 has a digital control line
for low power applications to lower quiescent current. The
device is self-contained with 50Ω input and output that is
matched to obtain optimum power, efficiency and linear-
ity. The module is a 4mmx4mm land grid array with back-
side ground. The RF6100-1 is footprint compatible with
industry standard 4mmx4mm CDMA modules, and
requires only one decoupling capacitor.
4.00
1 ± 0.10
1.40
1.25
4.00
± 0.10
0.450
± 0.075
3.900 TYP
2.425
2.200
1.800
1.525
1.350
0.950
0.500 TYP
0.100 TYP
0.000
R0.20 TYP
1 3.549
3.500
3.050
2.650
2.400 TYP
2.200
1.800
1.650
1.350
0.950
0.725
0.125
Optimum Technology Matching® Applied
Si BJT
9GaAs HBT
GaAs MESFET
Si Bi-CMOS
SiGe HBT
Si CMOS
InGaP/HBT
GaN HEMT
SiGe Bi-CMOS
VREG 1
VMODE 2
GND 3
RF IN 4
VCC1 5
Bias
10 GND
9 GND
8 RF OUT
7 GND
6 VCC2
Package Style: Module (4mmx4mm)
Features
• Input/Output Internally Matched@50Ω
• 28dBm Linear Output Power
• 40% Peak Linear Efficiency
• -50dBc ACPR @ 885kHz
• 29dB Linear Gain
• 53% AMPS Efficiency
Ordering Information
RF6100-1
3V 900MHz Linear Power Amplifier Module
RF6100-1PCBA-41X Fully Assembled Evaluation Board
Functional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A1 050929
2-689






RF6100-1 Datasheet, Funktion
RF6100-1
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is
3μinch to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land and Solder Mask Pattern
A = 0.40 (mm) Sq. Typ.
Pin 1
3.40 (mm)
A
2.55 (mm)
A
1.70 (mm) Typ.
A
0.85 (mm) Typ.
A
0.00 A
A
A
3.60 (mm)
2.35 (mm)
1.05 (mm)
0.65 (mm)
A = 0.55 (mm) Sq. Typ.
B = 2.65 x 3.95 (mm)
Pin 1
3.40 (mm) Typ.
A
A
2.55 (mm) Typ.
A
A
1.70 (mm) Typ.
A
B
A
0.85 (mm) Typ.
A
A
0.00 A
A
Metal Land Pattern
Figure 1. PCB Metal Land and Solder Mask Pattern (Top View)
Solder Mask Pattern
Thermal Pad and Via Design
The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bot-
tom of the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating
routing strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size
on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested
that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
2-694
Rev A1 050929

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