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34702 Schematic ( PDF Datasheet ) - Freescale Semiconductor

Teilenummer 34702
Beschreibung Switch-Mode Power Supply
Hersteller Freescale Semiconductor
Logo Freescale Semiconductor Logo 




Gesamt 30 Seiten
34702 Datasheet, Funktion
www.DFaretaeSshceeatl4eUS.ceommiconductor
Technical Data
3.0 A Switch-Mode Power
Supply with Linear Regulator
The 34702 provides the means to efficiently supply the Freescale
Power QUICC™ I, II, and other families of Freescale
microprocessors and DSPs. The 34702 incorporates a high-
performance switching regulator, providing the direct supply for the
microprocessor’s core, and a low dropout (LDO) linear regulator
control circuit providing the microprocessor I/O and bus voltage.
The switching regulator is a high-efficiency synchronous buck
regulator with integrated N-channel power MOSFETs to provide
protection features and to allow space-efficient, compact design.
The 34702 incorporates many advanced features; e.g., precisely
maintained up/down power sequencing, ensuring the proper
operation and protection of the CPU and power system.
Features
• Operating Voltage from 2.8 V to 6.0 V
• High-Accuracy Output Voltages
• Fast Transient Response
• Switcher Output Current Up to 3.0 A
• Undervoltage Lockout and Overcurrent Protection
• Enable Inputs and Programmable Watchdog Timer
• Voltage Margining via I2C™ Bus
• Reset with Programmable Power-ON Delay
• Pb-Free Packaging Designated by Suffix Code EK
I2C is a trademark of Philips Corporation.
Document Number: MC34702
Rev 6.0, 2/2007
34702
POWER SUPPLY
INTEGRATED CIRCUIT
EK (PB-FREE) SUFFIX
98AARH99137A
32-PIN SOICW
ORDERING INFORMATION
Device
MC34702EK/R2
Temperature
Range (TA)
-40 to 85°C
Package
32 SOICW
Optional
2.8 V to 6.0 V Input
34702
VIN2 VIN1
VBD
VBST
RT
LDRV
CS
LDO
ADDR
SDA
SCL
GND
EN1
EN2
CLKSYN
CLKSEL
FREQ
LFB
RST
BOOT
SW
VOUT
PGND
INV
VDDI
Other
Circuits
Adjustable:
0.8 V to VIN -
Dropout
VDDH (I/Os)
MPC8xxx
VBST
PORESET
Adjustable:
0.8 V to VIN -
Dropout
VDDL (Core)
Figure 1. 34702 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2007. All rights reserved.






34702 Datasheet, Funktion
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Storage Temperature
Peak Package Reflow Temperature During Reflow (2), (3)
TSTG
TPPRT
-65 to 150
Note 3
°C
°C
Maximum Junction Temperature
TJMAX
125 °C
Thermal Resistance
Junction to Ambient (Single Layer) (4), (5)
Junction to Ambient (Four Layers) (4), (5)
RθJA
°C/W
70
55
Thermal Resistance, Junction to Base (6)
RθJB
18 °C/W
Operational Package Temperature (Ambient Temperature)
TA
-40 to 85
°C
Notes
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics..
4. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.
5. Per JEDEC JESD51-6 with the board horizontal
6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
34702
6
Analog Integrated Circuit Device Data
Freescale Semiconductor

6 Page









34702 pdf, datenblatt
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. DYNAMIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions -40°C TA 85°C unless otherwise noted. Input voltages VIN1 = VIN2 = 3.3 V using
the typical application circuit (see Figures 33) unless otherwise noted.
Characteristic
Symbol Min Typ Max Unit
BUCK CONVERTER
Duty Cycle Range (Normal Operation) (18)
D 0 – 95 %
Switching Node SW Rise Time (18)
VIN = 5.0 V, ILOAD = 1.0 A
tRISE
ns
– 7.0 –
Switching Node SW Fall Time (18)
VIN = 5.0 V, ILOAD = 1.0 A
tFALL
ns
– 17 –
Maximum Deadtime (18)
Buck Control Loop Propagation Delay (18)
VINV < 0.8 V to VSW > 90% of High Level or VINV > 0.8 V to VSW < 10%
of Low Level
tD
tPD
– 35 – ns
ns
– 50 –
Soft Start Duration (Power Sequencing Disabled, EN1 = 1, EN2 = 1) (18)
tSS
200 350 800 µs
Fault Condition Time-Out (18)
tFAULT
10
– ms
Retry Timer Cycle (18)
tRet – 100 – ms
OSCILLATOR
Oscillator Center Frequency(20)
RF = 11.3 k
fOSC
kHz
270 300 330
Oscillator Frequency Range
Oscillator Frequency Adjusting Resistor Range
Oscillator Frequency Adjustment (19), (20)
RF = 7.0 k
Oscillator Frequency Adjustment (19), (20)
RF = 22 k
fOSC
200
400 kHz
RFREQ
7.0
22 k
fOSC
400 –
kHz
fOSC
kHz
– – 200
Oscillator Default Frequency (Switching Frequency), FREQ Pin Open
Oscillator Output Signal Duty Cycle (Square Wave, 180° Out-of-Phase with
the Internal Suitable Oscillator)
Synchronization Pulse Minimum Duration (18)
Notes
18. Design information only. This parameter is not production tested.
19. see Figure 4 for more details
20. RF = RFREQ resistor connected to the FREQ pin.
fOSC
DOSC
tSYNC
– 300
40 50
1.0 –
– kHz
%
60
µs
34702
12
Analog Integrated Circuit Device Data
Freescale Semiconductor

12 Page





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