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PDF ECG006 Data sheet ( Hoja de datos )
| Número de pieza | ECG006 | |
| Descripción | InGaP HBT Gain Block | |
| Fabricantes | WJ Communication | |
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ECG006www.DataSheet4U.com
InGaP HBT Gain Block
Product Features
• DC – 5.5 GHz
• +15.5 dBm P1dB at 1 GHz
• +32 dBm OIP3 at 1 GHz
• 15 dB Gain at 1 GHz
• 3.7 dB Noise Figure
• Available in lead-free/green SOT-86,
SOT-363, & SOT-89 package styles
• Internally matched to 50 Ω
Applications
• Mobile Infrastructure
• CATV / FTTX
• W-LAN / ISM
• RFID
• WiMAX / WiBro
Product Description
The ECG006 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG006 typically provides 15
dB of gain, +32 dBm Output IP3, and +15.5 dBm P1dB.
The ECG006 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in low-cost,
surface-mountable plastic lead-free/green/RoHS-compliant
SOT-363, SOT-86 and SOT-89 packages. All devices are
100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG006 will work for other various applications within
the DC to 5.5 GHz frequency range such as CATV and
mobile wireless.
Functional Diagram
GND
4
123
RF IN GND RF OUT
ECG006B-G
GND
4
RF In
1
RF Out
3
2
GND
ECG006C-G
GND 1
6 RF OUT
GND 2
5 GND
RF IN 3
4 GND
ECG006F-G
Specifications (1)
Typical Performance (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
Units
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Min
DC
12
+12
3.5
Typ
1000
15
+15.4
+32
2000
14
18
14
+15
+32
4.0
3.9
45
Max
5500
18
4.3
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, Rbias = 24.3 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
15.5
-20
-16
+15.8
+32
3.7
Typical
900 1900
15 14.2
-14 -17.4
-13 -14.5
+15.4 +15
+32 +30
3.7 3.7
2140
14
-18
-15
+15
+30
3.7
Ordering Information
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
Device Current
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 °C
-55 to +150 °C
150 mA
+12 dBm
+250 °C
Part No.
ECG006B-G
ECG006C-G
ECG006F-G
ECG006B-PCB
ECG006C-PCB
ECG006F-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 package)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-363 package)
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
Page 1 of 7 April 2007
1 page  
ECG006
InGaP HBT Gain Block
ECG006C-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a two-digit
numeric lot code (shown as “XX”) followed
with an “I” designator on the top surface of the
package. The obsolete tin-lead package is
marked with a two-digit numeric lot code
followed with a “N” designator; it may also
have been marked with a “N” designator
followed by a two-digit lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Rating
-40 to +85 °C
233 °C/W
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
Page 5 of 7 April 2007
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet ECG006.PDF ] | |
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