AG103 Datasheet PDF - WJ Communication
| Part Number | AG103 | |
| Description | High Dynamic Range Gain Block | |
| Manufacturers | WJ Communication | |
| Logo |  |
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AG103www.DataSheet4U.com
High Dynamic Range Gain Block
The Communications Edge TM
Product Information
Product Features
• 50 – 870 MHz
• 13 dB Gain
• 3 dB Noise Figure
• >+36 dBm OIP3
• +20 dBm P1dB
• Single +5 Bias Supply
• Internally matched to 50 Ω
• Lead-free/Green/RoHS-
compliant SOT-89 Package
• MTTF > 1000 years
Applications
• Mobile Infrastructure
• CATV / DBS
• Defense / Homeland Security
• NMT-450 Infrastructure
Specifications (1)
Product Description
The AG103 is a general-purpose gain block that offers good
dynamic range and low noise figure in a low-cost surface-
mount package. The combination of high OIP3 and tight
gain variation window makes it attractive for a multitude of
applications. The device combines dependable performance
with superb quality to maintain MTTF values exceeding
1000 years at mounting temperatures of +85°C and is
available in both the standard SOT-89 package and the
environmentally-friendly lead-free/green/RoHS-compliant
and green SOT-89 package. All devices are 100% RF &
DC tested.
The AG103 uses a high reliability GaAs MMIC technology
and only requires DC-blocking and bypass capacitors, and
an inductive RF choke for operation. Internal matching
provides a 50 ohm input / output impedance minimizing the
number of required external components.
The AG103 GaAs MMIC amplifier is well suited for
wireless infrastructure such as NMT-450, homeland
security, and 2nd generation mobile infrastructure utilizing
the cellular band. In addition, the amplifier can be used for
applications in various IF frequency bands.
Functional Diagram
GND
4
1
RF IN
2
GND
3
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Noise Figure
Operating Current Range
Supply Voltage
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
mA
V
Min
50
12
+33
120
Typ
800
12.9
10
20
+20
>+36
2.9
150
+5
Max
870
14
180
1. Test conditions unless otherwise noted: T = 25º C, 50 Ω system.
2. S11 and Noise Figure can be improved using an optional input matching network (typically just a series inductor).
Comment
See note 2
Pout = +5 dBm/tone, 10 MHz spacing.
See note 2
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 °C
-55 to +150 °C
+6 V
+10 dBm
+220° C
Ordering Information
Part No.
AG103
AG103-G
AG103-PCB
Description
GaAs MMIC Gain Block
(leaded SOT-89 Pkg)
GaAs MMIC Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
200 – 600 MHz Fully Assembled Application Circuit
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice.
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
September 2004
|
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AG103www.DataSheet4U.com
High Dynamic Range Gain Block
The Communications Edge TM
Product Information
AG103-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG103-G will be marked with an
“103G” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1B
Value:
Passes 500V to <1000V
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes 1000V to <2000V
Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
Thermal Specifications
Parameter
Rating
MTTF vs. GND Tab Temperature
1000
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85°C
59° C / W
129° C
100
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
10
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 °C.
1
60 70 80 90 100 110
Tab Temperature (°C)
Specifications and information are subject to change without notice.
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
September 2004
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