Datenblatt-pdf.com


C0805C102G5GAC Schematic ( PDF Datasheet ) - Kemet Electronics

Teilenummer C0805C102G5GAC
Beschreibung Ceramic Chip Capacitors
Hersteller Kemet Electronics
Logo Kemet Electronics Logo 




Gesamt 9 Seiten
C0805C102G5GAC Datasheet, Funktion
CERAMIC CHIP CAPACITORS
FEATURES
C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
10, 16, 25, 50, 100 and 200 Volts
Standard End Metalization: Tin-plate over nickel
barrier
Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
W
T
S
L
TIN PLATE
B
NICKEL PLATE
ELECTRODES CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA
SIZE CODE
0402*
www.DataSheet4U.com
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
L#
LENGTH
1.0 (.04) ± .05(.002)
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
W#
WIDTH
0.5 (.02) ± .05 (.002)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
See page 77
for thickness
dimensions.7
B
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
0.35 (.014) ±0.15 (.006)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 96.)
For extended value 1210 case size solder reflow only.
S
MIN. SEPARATION
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
Solder Wave
or
Solder Reflow
Solder
Reflow
CAPACITOR ORDERING INFORMATION (Standard Chips - For
C 0805 C 103 K 5 R A C*
Military see page 90)
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B ±0.10pF J ±5%
C ±0.25pF K ±10%
D ±0.5pF M ±20%
F ±1%
P (GMV) special order only
G ±2%
Z +80%, -20%
* Part Number Example: C0805C103K5RAC
END METALLIZATION
C-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G C0G (NP0) (±30 PPM/°C)
R X7R (±15%) (-55°C + 125°C)
PX5R (±15%) (-55°C + 85°C)
U Z5U (+22%, -56%) (+10°C + 85°C)
V Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
1 - 100V 3 - 25V
2 - 200V 4 - 16V
5 - 50V
8 - 10V
(14 digits - no spaces) 7 - 4V
9 - 6.3V
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
71






C0805C102G5GAC Datasheet, Funktion
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 Newton to 1.0 Newton (10g to 100g)
12 mm
0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165Њ to 180Њ from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 ±10 mm/minute.
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13reels are preferred.
4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
www.DataSheet4U.com
Tape Size
8 mm
and
12 mm
Tape Size
8 mm
Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)
Constant Dimensions — Millimeters (Inches)
D0 E P0 P2 T Max
1.5
+0.10 -0.0
(0.059
+0.004, -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.600
(0.024)
Variable Dimensions — Millimeters (Inches)
Pitch
B1 Max. D1 Min.
Note 1 Note 2
F
P1 R Min.
Note 3
Single
(4 mm)
4.4
(0.173)
1.0 3.5 ±0.05
4.0 ±0.10 25.0
(0.039) (0.138 ±0.002) (0.157 ±0.004) (0.984)
T1 Max
0.100
(0.004)
T2 Max
2.5
W
8.0 ±0.30
A0B0K0
Note 4
(0.098) (.315 ±0.012)
12 mm
Double
(8 mm)
8.2
(0.323)
1.5 5.5 ±0.05
8.0 ±0.10 30.0 4.6 12.0 ±0.30
(0.059) (0.217 ±0.002) (0.315 ±0.004) (1.181) (0.181) (0.472 ±0.012)
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius Rwithout damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93

6 Page







SeitenGesamt 9 Seiten
PDF Download[ C0805C102G5GAC Schematic.PDF ]

Link teilen




Besondere Datenblatt

TeilenummerBeschreibungHersteller
C0805C102G5GACCeramic Chip CapacitorsKemet Electronics
Kemet Electronics
C0805C102G5GACMultilayer Ceramic CapacitorsVishay Intertechnology
Vishay Intertechnology

TeilenummerBeschreibungHersteller
CD40175BC

Hex D-Type Flip-Flop / Quad D-Type Flip-Flop.

Fairchild Semiconductor
Fairchild Semiconductor
KTD1146

EPITAXIAL PLANAR NPN TRANSISTOR.

KEC
KEC


www.Datenblatt-PDF.com       |      2020       |      Kontakt     |      Suche