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EL5611 Schematic ( PDF Datasheet ) - Intersil Corporation

Teilenummer EL5611
Beschreibung (EL5611 / EL5811) 60MHz Rail-to-Rail Input-Output VCOM Amplifiers
Hersteller Intersil Corporation
Logo Intersil Corporation Logo 




Gesamt 12 Seiten
EL5611 Datasheet, Funktion
®
Data Sheet
EL5611, EL5811
August 3, 2005
FN7355.1
60MHz Rail-to-Rail Input-Output VCOM
Amplifiers
The EL5611 and EL5811 are low power, high voltage rail-to-
rail input-output amplifiers targeted primarily at VCOM
applications in TFT-LCD displays. The EL5611 contains six
amplifiers, and the EL5811 contains eight amplifiers.
Operating on supplies ranging from 5V to 15V, while
consuming only 2.5mA per amplifier, the EL5611 and
EL5811 have a bandwidth of 60MHz (-3dB). They also
provide common mode input ability beyond the supply rails,
as well as rail-to-rail output capability. This enables these
amplifiers to offer maximum dynamic range at any supply
voltage.
The EL5611 and EL5811 also feature fast slewing and
settling times, as well as a high output drive capability of
65mA (sink and source). In addition to VCOM applications,
these features make these amplifiers ideal for high speed
filtering and signal conditioning application. Other
applications include battery power, portable devices, and
anywhere low power consumption is important.
The EL5611 is available in 8-pin MSOP and 8-pin HMSOP
packages. The EL5811 is available in space-saving 28-pin
HTSSOPwww.DataSheet4U.com packages.These amplifiers operate over a
temperature range of -40°C to +85°C.
Ordering Information
PART NUMBER
EL5611IRE
EL5611IRE-T7
EL5611IRE-T13
EL5811IREZ
(See Note)
EL5811IREZ-T7
(See Note)
EL5811IREZ-T13
(See Note)
EL5811IREZ
(See Note)
EL5811IREZ-T7
(See Note)
PACKAGE
24-Pin HTSSOP
24-Pin HTSSOP
24-Pin HTSSOP
28-Pin HTSSOP
(Pb-free)
28-Pin HTSSOP
(Pb-free)
28-Pin HTSSOP
(Pb-free)
28-Pin HTSSOP
(Pb-Free)
28-Pin HTSSOP
(Pb-Free)
TAPE &
REEL
-
7”
13”
-
7”
13”
-
7”
PKG. DWG. #
MDP0048
MDP0048
MDP0048
MDP0048
MDP0048
MDP0048
MDP0048
MDP0048
Features
• 60MHz -3dB bandwidth
• Supply voltage = 4.5V to 16.5V
• Low supply current (per amplifier) = 2.5mA
• High slew rate = 75V/µs
• Unity-gain stable
• Beyond the rails input capability
• Rail-to-rail output swing
• ±180mA output short current
• Pb-Free plus anneal available (RoHS compliant)
Applications
• TFT-LCD panels
• VCOM amplifiers
• Drivers for A-to-D converters
• Data acquisition
• Video processing
• Audio processing
• Active filters
• Test equipment
• Battery-powered applications
• Portable equipment
Ordering Information (Continued)
PART NUMBER
PACKAGE
TAPE &
REEL PKG. DWG. #
EL5811IREZ-T13 28-Pin HTSSOP
(See Note)
(Pb-Free)
13”
MDP0048
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2004, 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.






EL5611 Datasheet, Funktion
Typical Performance Curves
EL5611, EL5811
500
VS=±5V
TA=25°C
400
TYPICAL
PRODUCTION
DISTRIBUTION
300
200
100
0
INPUT OFFSET VOLTAGE (mV)
FIGURE 1. INPUT OFFSET VOLTAGE DISTRIBUTION
25
VS=±5V
20
TYPICAL
PRODUCTION
DISTRIBUTION
15
10
5
0
INPUT OFFSET VOLTAGE DRIFT, TCVOS (µV/°C)
FIGURE 2. INPUT OFFSET VOLTAGE DRIFT
2
1.5
1
0.5
0
-0.5
-50
-10 30 70 110
TEMPERATURE (°C)
150
FIGURE 3. INPUT OFFSET VOLTAGE vs TEMPERATURE
0.008
VS=±5V
0.004
0
-0.004
-0.008
-0.012
-50
-10 30 70 110
TEMPERATURE (°C)
150
FIGURE 4. INPUT BIAS CURRENT vs TEMPERATURE
4.96
4.94
VS=±5V
IOUT=5mA
4.92
4.90
4.88
4.86
-50
-10 30 70 110
TEMPERATURE (°C)
150
FIGURE 5. OUTPUT HIGH VOLTAGE vs TEMPERATURE
-4.85
-4.87
VS=±5V
IOUT=5mA
-4.89
-4.91
-4.93
-4.95
-50
-10 30 70 110
TEMPERATURE (°C)
150
FIGURE 6. OUTPUT LOW VOLTAGE vs TEMPERATURE
6 FN7355.1
August 3, 2005

6 Page









EL5611 pdf, datenblatt
EL5611, EL5811
when sourcing, and:
PDMAX = Σi[VS × ISMAX + (VOUTi VS- ) × ILOADi ]
when sinking,
where:
• i = 1 to 6 for EL5611 and 1 to 8 for EL5811
• VS = Total supply voltage
• ISMAX = Maximum supply current per amplifier
• VOUTi = Maximum output voltage of the application
• ILOADi = Load current
If we set the two PDMAX equations equal to each other, we
can solve for RLOADi to avoid device overheat. Figures 29
and 30 provide a convenient way to see if the device will
overheat. The maximum safe power dissipation can be
found graphically, based on the package type and the
ambient temperature. By using the previous equation, it is a
simple matter to see if PDMAX exceeds the device's power
derating curves. To ensure proper operation, it is important
to observe the recommended derating curves shown in
Figures 29 & 30.
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - HTSSOP
EXPOSED DIEPAD SOLDERED TO PCB PER
JESD51-5
3.5
3.333W
3
3.030W
2.5
HTSSOP28
2 θJA=30°C/W
1.5 HTSSOP24
θJA=33°C/W
1
0.5
0
0 25 50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 29. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1
0.9 909mW
0.8 833mW
0.7
0.6
0.5 HTSSOP24
0.4 θJA=120°C/W
0.3
HTSSOP28
θJA=110°C/W
0.2
0.1
0
0 25 50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Unused Amplifiers
It is recommended that any unused amplifiers in a dual and
a quad package be configured as a unity gain follower. The
inverting input should be directly connected to the output
and the non-inverting input tied to the ground plane.
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5611 and EL5811 can provide gain at high frequency.
As with any high-frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the VS- pin is
connected to ground, a 0.1µF ceramic capacitor should be
placed from VS+ to pin to VS- pin. A 4.7µF tantalum
capacitor should then be connected in parallel, placed in the
region of the amplifier. One 4.7µF capacitor may be used for
multiple devices. This same capacitor combination should be
placed at each supply pin to ground if split supplies are to be
used.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
12 FN7355.1
August 3, 2005

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