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Teilenummer | P0408FCxxC |
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Beschreibung | PFLIP CHIP ARRAY | |
Hersteller | Protek Devices | |
Logo | ||
Gesamt 6 Seiten APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 4 to 7 Lines
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Lead-Free Plating
✔ Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Consult Factory for Leaded Device Availability
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
P0408FC3.3C*
thru
P0408FC36C*
PFLIP CHIP ARRAY
0402 CHIP SHOWN
05156.R6 2/07
1 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
0408 PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
COPPER CONTACT 0.009” [0.23] DIA.
A
DIE
SOLDER
BUMP
I
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER
MASK
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. OrderingSuffix: -T75-1, i.e., P0408FC05C-T75-1.
3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2, i.e., P0408FC05C-T75-2.
4. Suffix - LF = Lead-Free, i.e., P0408FC05C-LF-T75-1.
P0408FC3.3C*
thru
P0408FC36C*
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A 0.51
F 0.15 SQ
G 0.71
H 0.99
I 0.51
0.020
0.006 SQ
0.028
0.039
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
TAPE & REEL ORIENTATION
Quad Die - 0408
NOTE:
1. Top view of tape. Solder bumps are face down in tape
package.
Outline & Dimensions: Rev 4 - 2/04, 06021
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
05156.R6 2/07
6 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
6 Page | ||
Seiten | Gesamt 6 Seiten | |
PDF Download | [ P0408FCxxC Schematic.PDF ] |
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