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What is EL7158?

This electronic component, produced by the manufacturer "Intersil Corporation", performs the same function as "Ultra-High Current Pin Driver".


EL7158 Datasheet PDF - Intersil Corporation

Part Number EL7158
Description Ultra-High Current Pin Driver
Manufacturers Intersil Corporation 
Logo Intersil Corporation Logo 


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®
Data Sheet
July 26, 2004
EL7158
FN7349.1
Ultra-High Current Pin Driver
Features
The EL7158 high performance pin
driver with three-state is suited to
many ATE and level-shifting
applications. The 12A peak drive capability makes this part
an excellent choice when driving high capacitance loads.
The output pin OUT is connected to input pins VH or VL
respectively, depending on the status of the IN pin. When the
OE pin is active low, the output is placed in the three-state
mode. The isolation of the output FETs from the power
supplies enables VH and VL to be set independently,
enabling level-shifting to be implemented. Related to the
EL7155, the EL7158 adds a lower supply pin VS- and makes
VL an isolated and independent input. This feature adds
applications flexibility and improves switching response due
to the increased enhancement of the output FETs.
• Clocking speeds up to 40MHz
• 12ns tR/tF at 2000pF CLOAD
• 0.2ns rise and fall times mismatch
• 0.5ns TON-TOFF prop delay mismatch
• 3.5pF typical input capacitance
• 12A peak drive
• Low on resistance of 0.5
• High capacitive drive capability
• Operates from 4.5V to 12V
• Pb-free available
Applications
This pin driver has improved performance over existing pin
drivers. It is specifically designed to operate at voltages
down to 0V across the switch elements while maintaining
good speed and on-resistance characteristics.
• ATE/burn-in testers
• Level shifting
• IGBT drivers
Available in the 8-pin SO package, the EL7158 is specified
• CCD drivers
for operation over the full -40°C to +85°C temperature range.www.DataSheet4U.com
Pinout
EL7158
(8-PIN SO)
TOP VIEW
VS+ 1
OE 2
IN 3
GND 4
L
O
G
I
C
8 VH
7 OUT
6 VL
5 VS-
Ordering Information
PART NUMBER PACKAGE TAPE & REEL PKG. DWG. #
EL7158IS
8-Pin SO
-
MDP0027
EL7158IS-T7
8-Pin SO
7”
MDP0027
EL7158IS-T13
8-Pin SO
13” MDP0027
EL7158ISZ
8-Pin SO
-
MDP0027
(See Note)
(Pb-free)
EL7158ISZ-T7
8-Pin SO
7”
MDP0027
(See Note)
(Pb-free)
EL7158ISZ-T13
(See Note)
8-Pin SO
(Pb-free)
13” MDP0027
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003, 2004. All Rights Reserved. Elantec is a registered trademark of Elantec Semiconductor, Inc.
All other trademarks mentioned are the property of their respective owners.

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EL7158 equivalent
Typical Performance Curves (Continued)
EL7158
26 CL=2000pF, VS+=VH=12V, VS-=VL=0V
24
tD1
22
tD2
20
18
-50
-25
0 25 50 75
TEMPERATURE (°C)
100 125
FIGURE 7. PROPAGATION DELAY vs TEMPERATURE
VS+=+12V, T=25°C
70
60
50
40
tF
30
20
10 tR
0
100 1K 10K
LOAD CAPACITANCE (pF)
FIGURE 8. RISE/FALL TIME vs LOAD CAPACITANCE
5 VS+=VH=12V, VS-=VL=0V, T=25°C, f=20kHz
4
3
2
1
0
100 1K 10K
LOAD CAPACITANCE (pF)
FIGURE 9. SUPPLY CURRENT vs LOAD CAPACITANCE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1
0.9
0.8
0.7 625mW
0.6
0.5
0.4
0.3
θJA =1S60O°8C/W
0.2
0.1
0
0 25 50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
100 CL=1000pF, T=25°C
10 VS+=12V
VS+=10V
1.0
VS+=5V
0.1
10K
100K
1M
FREQUENCY (Hz)
10M
FIGURE 10. SUPPLY CURRENT vs FREQUENCY
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2
1 909mW
0.8
0.6
θJA =110S°OC8/W
0.4
0.2
0
0 25 50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 12. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
5


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Part Details

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