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PDF ADA4417-3 Data sheet ( Hoja de datos )
| Número de pieza | ADA4417-3 | |
| Descripción | Integrated Triple Video Filter | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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FEATURES
Optimized for high definition video
Sixth-order Butterworth filters
−1 dB bandwidth of 38 MHz
44 dB rejection at 75 MHz
5 ns group delay variation
Fixed throughput gain of ×2
0.06% differential gain
0.21° differential phase
Pin selectable output offset (DCO)
Single-supply operation
3.3 V to 5 V range
Rail-to-rail output
Output ESD protection exceeds 8 kV
Small packaging: 10-lead MSOP
APPLICATIONS
Set-top boxes
HDTVs
Projectors
DVD players/recorders
Personal video recorders
GENERAL DESCRIPTION
The ADA4417-3 is a low cost, fully integrated, video
reconstruction filter specifically designed for consumer high
definition video. With 1 dB frequency flatness out to 38 MHz,
and 44 dB of rejection at 75 MHz, the ADA4417-3 can handle
the most demanding HD video applications.
The ADA4417-3 operates on a single 3.3 V to 5 V supply. It is
well-suited for applications where power consumption is
critical. A disable feature allows for further power conservation
by reducing the supply current to 10 μA (typical) when the
device is not in use. With rail-to-rail output, it can be efficiently
used on a 3.3 V supply, while providing the user with a 2 V p-p
output. The buffers can drive two 75 Ω terminated loads, either
dc- or ac-coupled.
Integrated Triple Video Filter
for High Definition Video
ADA4417-3
FUNCTIONAL BLOCK DIAGRAM
Y/G IN
×1
Pb/B IN
×1
Pr/R IN
DCO
DISABLE
×1
36MHz
×2
Y/G OUT
36MHz
×2
Pb/B OUT
36MHz
×2
ADA4417-3
Figure 1.
Pr/R OUT
The ADA4417-3 also has an output dc offset function that can
operate in two states. When the DCO pin is tied to VCC, the
video signal at the output is offset by 200 mV. When the DCO
pin is tied to ground, the output dc level follows the input level.
The ADA4417-3 is available in a 10-lead MSOP package and is
rated for operation over the extended industrial temperature
range of −40°C to +85°C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2006 Analog Devices, Inc. All rights reserved.
1 page  
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Rating
5.5 V
See Figure 2
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
10-Lead MSOP
θJA Unit
130 °C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4417-3
package is limited by the associated rise in junction temperature
(TJ) on the die. At approximately 150°C, which is the glass
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the ADA4417-3. Exceeding a
junction temperature of 175°C for an extended period can
result in changes in the silicon devices potentially causing
failure.
ADA4417-3
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the supply voltage (VS) times the quiescent current (IS).
Assuming the load (RL) is midsupply, then the total drive power is
VS/2 × IOUT
some of which is dissipated in the package and some in the load
(VOUT × IOUT).
RMS output voltages should be considered. If RL is referenced to
GND, the total power is VS × IOUT.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduce the θJA.
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 10-lead MSOP
(130°C/W) on a JEDEC standard 4-layer board. θJA values are
approximate.
2.0
1.5
1.0
0.5
0
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80
AMBIENT TEMPERATURE (°C)
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 5 of 16
5 Page 
TEST CIRCUIT
NETWORK
ANALYZER Tx
50Ω
RT
50Ω
RL = 150Ω
DUT
118Ω
86.6Ω
NETWORK
ANALYZER Rx
50Ω
MINIMUM-LOSS MATCHING NETWORK LOSS CALIBRATED OUT
Figure 25. Basic Test Circuit for Swept Frequency Measurements
ADA4417-3
Rev. 0 | Page 11 of 16
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet ADA4417-3.PDF ] | |
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