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PDF AD8387 Data sheet ( Hoja de datos )

Número de pieza AD8387
Descripción LCD DecDriver
Fabricantes Analog Devices 
Logotipo Analog Devices Logotipo



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No Preview Available ! AD8387 Hoja de datos, Descripción, Manual

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High Performance, 12-Bit, 12-Channel
Decimating, LCD DecDriver®
AD8387
FEATURES
High accuracy, high-resolution voltage outputs
1 mV channel matching
12-bit input resolution
Laser-trimmed outputs
Fast settling, high voltage drive
35 ns settling time to 0.25% into 150 pF load
Slew rate 420 V/μs
Outputs to within 1.3 V of supply rails
High update rates
Fast, 110 MHz clock
Programmable video reference (brightness) and
full-scale (contrast) output levels
Flexible logic
INV bit reverses polarity of video signal
R/L reverses loading order of data
ISW selects frame/row or column/dot inversion
DSW selects single or dual data bus mode
Output short-circuit protection
3.3 V logic, 11 V to 18 V analog supplies
Available in 80-lead, 12 mm × 12 mm, TQFP E-pad
APPLICATIONS
LCD microdisplay driver
GENERAL DESCRIPTION
The AD8387 DecDriver provides dual, fast latched, 12-bit
decimating input, which drives 12 high voltage outputs. Twelve-
bit input words are loaded into 12 separate high speed, bipolar
DACs sequentially. Flexible digital input format allows more
than one AD8387 to be used in parallel for higher resolution
displays. The output signal can be adjusted for dc reference,
signal inversion, and contrast for maximum flexibility.
The AD8387 is fabricated on ADI’s fast bipolar, 26 V XFCB
process, providing fast input logic, bipolar DACs with trimmed
accuracy and fast settling, high voltage, precision drive
amplifiers on the same chip.
The AD8387 dissipates 1.34 W nominal static power. The
AD8387 is offered in an 80-lead TQFP E-pad package and
operates over the commercial temperature range of 0°C to
+85°C.
FUNCTIONAL BLOCK DIAGRAM
DBA(0:11)
DBB(0:11)
12
12
12 TWO-STAGE 12
LATCH
DAC
12
TWO-STAGE 12
LATCH
DAC
BYP
TSW
GSW
DSW
CLK
XFR
R/L
BIAS
THERMAL
SWITCH
G-MODE
SWITCH
12 TWO-STAGE 12
LATCH
DAC
12
TWO-STAGE 12
LATCH
DAC
SEQUENCE
CONTROL
INV ISW
AD8387
Figure 1.
SCALING
CONTROL
VRH VRL
VID0
VID1
VID10
VID11
5
4
3
CODE 0
2
1 CODE 4095
NORMAL PROJECTOR OPERATING
TEMPERATURE RANGE
CODE 2048
0
0 10 20 30 40 50 60 70
INTERNAL AMBIENT TEMPERATURE (°C)
Figure 2. Channel Matching vs. Temperature
80
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
© 2005 Analog Devices, Inc. All rights reserved.

1 page




AD8387 pdf
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltages
AVCCx − AGNDx
DVCC − DGND
Input Voltages
Maximum Digital Input Voltage
Minimum Digital Input Voltage
Maximum Analog Input Voltage
Minimum Analog Input Voltage
Internal Power Dissipation1
TQFP E-Pad @ TA = 25°C
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 10 sec)
18 V
4.5 V
DVCC + 0.5 V
DGND − 0.5 V
AVCC + 0.5 V
AGND − 0.5 V
4.38 W
0°C to 85°C
−65°C to +125°C
300°C
1 80-lead TQFP E-Pad:
θJA = 28.5°C/W (still air) [JEDEC Standard, 4-layer PCB in still air]
θJC = 12.2°C/W
θJB = 14.6°C/W
ΨJB = 12.0°C/W
ΨJT = 0.3°C/W.
Stresses above those listed under the Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to the
absolute maximum ratings for extended periods may reduce
device reliability.
EXPOSED PADDLE
To ensure optimized thermal performance, the exposed paddle
must be thermally connected to an external plane, such as
AVCC or GND, as described in the Applications section.
OVERLOAD PROTECTION
The AD8387 overload protection circuit consists of an output
current limiter and a thermal switch.
When TSW is LOW, the thermal switch is disabled and the
output current limiter is enabled. The maximum current at any
one output is internally limited to 100 mA average. In the event
of a momentary short-circuit between a video output and a
power supply rail (VCC or AGND), the output current limit is
sufficiently low to provide temporary protection.
AD8387
When TSW is HIGH, the output current limiter, as well as the
thermal switch, is enabled. The thermal switch debiases the
output amplifier when the junction temperature reaches the
internally set trip point. In the event of an extended short-
circuit between a video output and a power supply rail, the
output amplifier current continues to switch between 0 and
100 mA typical with a period determined by the thermal time
constant and the hysteresis of the thermal trip point. The
thermal switch, when enabled, provides long-term protection
from accidental shorts during the assembly process by limiting
the average junction temperature to a safe level.
MAXIMUM POWER DISSIPATION
The maximum power that the AD8387 can safely dissipate is
limited by its junction temperature. The maximum safe junction
temperature for plastic encapsulated devices, as determined by the
glass transition temperature of the plastic, is approximately 150°C.
Exceeding this limit temporarily can cause a shift in the parametric
performance due to a change in the stresses exerted on the die by
the package. Exceeding a junction temperature of 150°C for an
extended period can result in device failure.
OPERATING TEMPERATURE RANGE
To ensure operation within the specified operating temperature
range, it is necessary to limit the maximum power dissipation as
follows.
3.0
200LFM
2.5
500LFM
STILL AIR
2.0
1.5
QUIESCENT
THERMAL
SWITCH
ENABLED
DISABLED
1.0
50 55 60 65 70 75 80 85 90 95 100
75 80 85 90 95 100 105 110 115 120 125
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature,
AD8387 on a 4-Layer JEDEC PCB with Thermally Optimized Landing
Pattern as Described in the Applications Section
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 5 of 16

5 Page





AD8387 arduino
AD8387
CLK
t1
DB(0:11)
XFR
t3
t5
t2
t1
t6
t2
t4 VTH
Figure 15. Input Timing (DSW = LOW)
VTH
VTH
CLK
DB(0:11) –2 –1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
XFR
INV
VRL + VFS
VID(0:11) 50%
VRL
t7
t8
PIXELS
–12, –11, –10, –9, –8, –7, –6, –5, –4, –3, –2, –1
VRL
t7 VRL–VFS
PIXELS
0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11
Figure 16. Output Timing (DSW = LOW)
Table 4.
Parameter
Data Setup Time: t1
XFR Setup Time: t3
Data Hold Time: t2
XFR Hold Time: t4
CLK High Time: t5
CLK Low Time: t6
CLK High Time: t7
CLK Low Time: t8
Data Switching Delay: t7
Data Switching Delay Skew: Δt7
Invert Switching Delay: t8
Invert Switching Delay Skew: Δt8
Conditions
DSW = HIGH
DSW = HIGH
DSW = LOW
DSW = LOW
VIDx = 5 V step
Min Typ Max Unit
0 ns
0 ns
3.5 ns
3.5 ns
2.5 ns
3.0 ns
3.5 ns
4.0 ns
15.7 ns
4 ns
16.2 ns
4 ns
Rev. 0 | Page 11 of 16

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