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AD8000 Schematic ( PDF Datasheet ) - Analog Devices

Teilenummer AD8000
Beschreibung Ultrahigh Speed Op Amp
Hersteller Analog Devices
Logo Analog Devices Logo 




Gesamt 18 Seiten
AD8000 Datasheet, Funktion
Data Sheet
1.5 GHz, Ultrahigh Speed Op Amp
AD8000
FEATURES
High speed
1.5 GHz, −3 dB bandwidth (G = +1)
650 MHz, full power bandwidth (G = +2, VO = 2 V p-p)
Slew rate: 4100 V/μs
0.1% settling time: 12 ns
Excellent video specifications
0.1 dB flatness: 170 MHz
Differential gain: 0.02%
Differential phase: 0.01°
Output overdrive recovery: 22 ns
Low noise: 1.6 nV/√Hz input voltage noise
Low distortion over wide bandwidth
75 dBc SFDR at 20 MHz
62 dBc SFDR at 50 MHz
Input offset voltage: 1 mV typical
High output current: 100 mA
Wide supply voltage range: 4.5 V to 12 V
Supply current: 13.5 mA
Power-down mode
APPLICATIONS
Professional video
High speed instrumentation
Video switching
IF/RF gain stage
CCD imaging
GENERAL DESCRIPTION
The AD8000 is an ultrahigh speed, high performance, current
feedback amplifier. Using Analog Devices, Inc., proprietary
eXtra Fast Complementary Bipolar (XFCB) process, the ampli-
fier can achieve a small signal bandwidth of 1.5 GHz and a slew
rate of 4100 V/μs.
The AD8000 has low spurious-free dynamic range (SFDR) of
75 dBc at 20 MHz and input voltage noise of 1.6 nV/√Hz. The
AD8000 can drive over 100 mA of load current with minimal
distortion. The amplifier can operate on +5 V to ±6 V. These
specifications make the AD8000 ideal for a variety of applica-
tions, including high speed instrumentation.
With a differential gain of 0.02%, differential phase of 0.01°, and
0.1 dB flatness out to 170 MHz, the AD8000 has excellent video
specifications, which ensure that even the most demanding
video systems maintain excellent fidelity.
CONNECTION DIAGRAMS
AD8000
TOP VIEW
(Not to Scale)
POWER DOWN 1
FEEDBACK 2
–IN 3
+IN 4
8 +VS
7 OUTPUT
6 NC
5 –VS
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PADDLE IS CONNECTED TO GROUND.
Figure 1. 8-Lead AD8000, 3 mm × 3 mm LFCSP (CP-8-13)
AD8000
TOP VIEW
(Not to Scale)
FEEDBACK 1
8 POWER DOWN
–IN 2
+IN 3
7 +VS
6 OUTPUT
–VS 4
5 NC
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PADDLE IS CONNECTED TO GROUND.
Figure 2. 8-Lead AD8000 SOIC_N_EP (RD-8-1)
The AD8000 power-down mode reduces the supply current to
1.3 mA. The amplifier is available in a tiny 8-lead LFCSP package,
as well as in an 8-lead SOIC package. The AD8000 is rated to work
over the extended industrial temperature range (−40°C to +125°C).
A triple version of the AD8000 (AD8003) is underdevelopment.
3
VS = 5V
2 RL = 150
VOUT = 2V p-p
1
0
–1
–2
–3
G = +2, RF = 432
–4
–5
–6
–7
1 10 100
FREQUENCY (MHz)
Figure 3. Large Signal Frequency Response
1000
Rev. C
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no re-
sponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2005–2016 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com






AD8000 Datasheet, Funktion
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage Range
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Rating
12.6 V
See Figure 4
−VS − 0.7 V to +VS + 0.7 V
VS
−65°C to +125°C
−40°C to +125°C
300°C
150°C
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any
other conditions above those indicated in the operational section of
this specification is not implied. Operation beyond the maximum
operating conditions for extended periods may affect product
reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is speci-
fied for device soldered in the circuit board for surface-mount
packages.
Table 4. Thermal Resistance
Package Type
θJA θJC Unit
8-Lead SOIC
80 30 °C/W
3 mm × 3 mm LFCSP
93 35 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8000 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 150C, which is the glass transition temperature,
the properties of the plastic change. Even temporarily exceeding
this temperature limit can change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the AD8000. Exceeding a junction temperature of 175C for
an extended period of time can result in changes in silicon de-
vices, potentially causing degradation or loss of functionality.
The power dissipated in the package (PD) is the sum of the qui-
escent power dissipation and the power dissipated in the die
due to the AD8000 drive at the output. The quiescent power is
the voltage between the supply pins (VS) times the quiescent
current (IS).
PD = Quiescent Power + (Total Drive Power Load Power)
AD8000
 PD VS I S

VS
2
VOUT
RL

VOUT
RL
2
Consider the RMS output voltages. If RL is referenced to −VS, as
in single-supply operation, the total drive power is VS × IOUT. If
the rms signal levels are indeterminate, consider the worst case,
when VOUT = VS/4 for RL to midsupply.
PD
VS
IS
VS / 42
RL
In single-supply operation with RL referenced to −VS, worst case
is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA. Also,
more metal directly in contact with the package leads and exposed
paddle from metal traces, through holes, ground, and power
planes reduces θJA.
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the exposed paddle
SOIC (80°C/W) and the LFCSP (93°C/W) package on a JEDEC
standard 4-layer board. θJA values are approximations.
3.0
2.5
2.0
SOIC
1.5
LFCSP
1.0
0.5
0
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120
AMBIENT TEMPERATURE (C)
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Rev. C | Page 5 of 17

6 Page









AD8000 pdf, datenblatt
Data Sheet
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
–0.25
–0.50
–0.75
–1.00
–1.25
–1.50
–1.75
0
G = +1
G = +2
VS = 5V
RF = 432
RS = 0
RL = 100
5 10 15 20 25 30 35 40
TIME (ns)
Figure 35. Large Signal Transient Response
45
50
0.5
G = +2
0.4 VIN
0.3
0.2 1V
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.5
–5
t = 0s
–4 –3
–2 –1
VCM (V)
0
5ns/DIV
123
Figure 36. Settling Time
6k
G = +2
RF = 432
5k RL = 150
SOIC, VS = 5V
4k
3k LFCSP, VS = 5V
2k SOIC, VS = +5V
LFCSP, VS = +5V
1k
0
01234567
VOUT (V p-p)
Figure 37. Slew Rate vs. Output Level
AD8000
5
VS = 5V, VIN
4
3 VS = 5V, VOUT
2
1
VS = 2.5V, VOUT
0
–1
–2 VS = 2.5V, VIN
–3
G = +1
–4 RL = 150
RF = 432
–5
0 200 400 600
TIME (ns)
Figure 38. Input Overdrive
800
1000
6
5 VS = 5V, 2 VIN
4 VS = 5V, VOUT
3
2
1
0
–1 VS = 2.5V, 2 VIN
–2
–3 VS = 2.5V, VOUT
–4 G = +2
–5
RL = 150
RF = 432
–6
0 200 400 600 800
TIME (ns)
Figure 39. Output Overdrive
1000
100
VS = 5V
G = +10
RF = 432
RN = 47.5
10
1
0.1
10
100 1k 10k 100k 1M
FREQUENCY (Hz)
Figure 40. Input Voltage Noise
10M 100M
Rev. C | Page 11 of 17

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