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PDF EMIF04-MMC02F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF04-MMC02F2 | |
| Descripción | 4 LINES EMI FILTER INCLUDING ESD PROTECTION | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de EMIF04-MMC02F2 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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®
IPAD™
EMIF04-MMC02F2
4 LINES EMI FILTER
INCLUDING ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required:
■ MultiMedia Card for mobile phones, Personal
Digital Assistant, Digital Camera, MP3 players...
DESCRIPTION
The EMIF04-MMC02 is a highly integrated devic-
es designed to suppress EMI/RFI noise for Multi-
Media Card port. The EMIF04 flip chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead free package
■ Very low PCB space consuming:
1.57 mm x 2.07 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4
15kV (air discharge)
8kV (contact discharge)
Flip-Chip
(11 Bumps)
Table 1: Order Code
Part Number
EMIF04-MMC02F2
Marking
FH
Figure 1: Pin Configuration (ball side)
321
I1 O1
A
I2 VD2 O2 B
I3 VD1 O3 C
I4 GND O4 D
Figure 2: Configuration
I1
I2
I3
I4
VD2 VD1
R1
R2
R3
R20
R4
R10
O1 (Data)
O2 (CLK)
O3 (CMD)
O4
TM: IPAD is a trademark of STMicroelectronics.
April 2005
GND
REV. 2
Cline = 20pF max.
1/7
1 page  
EMIF04-MMC02F2
Figure 10: Order Code
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
= 3: Leadfree Pitch = 400µm, Bump = 250µm
Figure 11: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
650µm ± 65
1.57mm ± 50µm
Figure 12: Foot Print Recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 13: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
545 400
E
xxz
y ww
All dimensions in µm
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF04-MMC02F2.PDF ] | |
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