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PDF EMIF06-HMC01F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF06-HMC01F2 | |
| Descripción | 6 LINES EMI FILTER INCLUDING ESD PROTECTION | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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®
IPAD™
EMIF06-HMC01F2
6 LINES EMI FILTER
INCLUDING ESD PROTECTION
MAIN APPLICATION
■ High Speed MultiMediaCard™
DESCRIPTION
The EMIF06-HMC01F2 is a highly integrated array
designed to suppress EMI / RFI noise for High
Speed MultiMediaCard™ port filtering.
The EMIF06-HMC01F2 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS
■ 6 lines low-pass-filter
■ High efficiency in EMI filtering
■ Very low PCB space consuming: < 4.4 mm2
■ Lead Free package
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on external pins15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
Figure 2: Configuration
Vmmc
MMCclk
MMCcmd
MMCdat0
MMCdat1
MMCdat2
MMCdat3
R10
R11
R12
R13
R14
R2
R3
R4
R5
R6
R7
Vmmc
clk
cmd
dat0
dat1
dat2
dat3
GND
Flip-Chip
(16 Bumps)
Table 1: Order Code
Part Number
EMIF06-HMC01F2
Marking
GH
Figure 1: Pin Configuration (ball side)
4321
A
B
C
D
Table 2: Ball configuration
A1 cmd C1
A2 clk C2
A3 Vmmc/Vdd C3
A4 MMCclk C4
B1 dat1 D1
B2 dat0 D2
B3 gnd D3
B4 MMCcmd D4
dat2
gnd
MMCdat1
MMCdat0
dat3
gnd
MMCdat3
MMCdat2
TM: IPAD is a trademark of STMicroelectronics.
January 2005
REV. 1
1/7
1 page  
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EMIF06-HMC01F2
Figure 10: Ordering Information Scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
= 3: Leadfree Pitch = 400µm, Bump = 250µm
Figure 11: FLIP-CHIP Package Mechanical Data
500µm ± 10
315µm ± 50
650µm ± 65
1.92mm ± 50µm
Figure 12: Foot Print Recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 13: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
365 240
E
xxz
y ww
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| PDF Descargar | [ Datasheet EMIF06-HMC01F2.PDF ] | |
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