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PDF EMIF06-1502M12 Data sheet ( Hoja de datos )
| Número de pieza | EMIF06-1502M12 | |
| Descripción | 6 line low capacitance EMI filter and ESD protection | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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IPAD™
EMIF06-1502M12
6 line low capacitance EMI filter and ESD protection
in Micro QFN package
Main product characteristics
Where EMI filtering in ESD sensitive equipment is
required:
■ LCD & CAMERA for Mobile phones
■ Computers and printers
■ Communication systems
■ MCU Boards
Description
The EMIF06-1502M12 is a 6 line highly integrated
device designed to suppress EMI/RFI noise in all
systems exposed to electromagnetic interference.
This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up to 15 kV on the input
pins.
Benefits
■ EMI asymmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consuming:
2.5 mm x 1.5 mm
■ Very thin package: 0.6 mm max
■ High efficiency in ESD suppression on inputs
pins (IEC 61000-4-2 level 4).
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration and wafer level packaging.
■ Lead free package
Complies with following standards:
IEC 61000-4-2
level 4 input pins
15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3 (all pins)
12 1
11 2
10 GGNNDD 3
94
85
76
Micro QFN 2.5 mm x 1.5 mm
(bottom view)
Pin configuration (top view)
1 Input
Output 12
2 Input
3 Input
4 Input
5 Input
6 Input
Output 11
Output 10
Output 9
Output 8
Output 7
Basic cell configuration
Input
170 Ω
Output
Typical line capacitance = 14 pF @ 2.5 V
Order code
Part number
EMIF06-1502M12
Marking
E
TM: IPAD is a trademark of STMicroelectronics
July 2006
Rev 2
www.st.com
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1 page  
EMIF06-1502M12
Figure 8. Tape and reel specification
2.0+/-0.05
4.00+/-0.1
Package information
f 1.5 +/- 0.1
XY XY XY
ww ww ww
0.75
1.70
4.00
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5/9
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| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet EMIF06-1502M12.PDF ] | |
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