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PDF AG604-89 Data sheet ( Hoja de datos )
| Número de pieza | AG604-89 | |
| Descripción | InGaP HBT Gain Block | |
| Fabricantes | WJ Communication | |
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AG604-89
InGaP HBT Gain Block
The Communications Edge TM
Product Information
Product Features
x DC – 2700 MHz
x +19.5 dBm P1dB at 900 MHz
x +33.5 dBm OIP3 at 900 MHz
x 21 dB Gain at 900 MHz
x Single Voltage Supply
x Lead-free / RoHS-compliant /
Green SOT-89 package
x Internally matched to 50 :
Applications
x Mobile Infrastructure
x CATV / FTTX
x W-LAN / ISM
x RFID
x WiMAX / WiBro
Product Description
Functional Diagram
The AG604-89 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG604-89 typically provides
21 dB of gain, +33.5 dBm OIP3, and +19.5 dBm P1dB.
The device combines dependable performance with
consistent quality to maintain MTTF values exceeding
1000 years at mounting temperatures of +85 qC and is
housed in a lead-free/green/RoHS-compliant SOT-89
industry-standard SMT package.
GND
4
1
RF IN
2
GND
3
RF OUT
The AG604-89 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation.
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG604-89 will work for other various applications
within the DC to 2.7 GHz frequency range such as CATV
and WiMAX.
Specifications (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Output IP2
Noise Figure
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
Min
DC
17.2
Typ
900
21.4
20
12
+19.4
+33.4
+45
3.5
1900
18.2
+19
+33.2
5.16
75
Max
2700
19.2
1. Test conditions: 25 ºC, Supply Voltage = +6 V, Rbias = 11.2 ¡ , 50 ¡ System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Typical Performance (1)
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
22.5
-18
-16
+19.4
+33.5
3.5
Typical
900 1900
21.4 18.2
-20 -35
-12 -10
+19.4 +19.0
+33.4 +33.2
3.5 3.8
2140
17.6
-25
-10
+19.0
+32.9
3.8
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 qC
-55 to +150 qC
+7 V
+10 dBm
+250 qC
Ordering Information
Part No.
AG604-89G
AG604-89PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
700 – 2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
Page 1 of 5 June 2006
1 page  
AG604-89
InGaP HBT Gain Block
The Communications Edge TM
Product Information
AG604-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded
(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG604-89G will be marked with an
“A604G” designator with an alphanumeric lot
code marked below the part designator. The
obsolete tin-lead package is marked with an
“AG604” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
Land Pattern
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Passes 1000V min.
¤
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes 1000V min.
¤
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 ¢ C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
Thermal Specifications
Parameter
Rating
MTTF vs. GND Tab Temperature
1000
(#80 / .0135” ) diameter drill and have a final plated thru
diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
-40 to +85 qC
154 qC / W
145 qC
100
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
10 5. RF trace width depends upon the PC board material and
1. The thermal resistance is referenced from the hottest
construction.
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5.16V, 75 mA at an 85 ¢ C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 ¢ C.
6. Use 1 oz. Copper minimum.
1
7. All dimensions are in millimeters (inches). Angles are in
degrees.
60 70 80 90 100 110 120
Tab Temperature (°C)
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
£
££
£
Page 5 of 5 June 2006
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