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CBT3257A Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer CBT3257A
Beschreibung Quad 1-of-2 multiplexer/demultiplexer
Hersteller NXP Semiconductors
Logo NXP Semiconductors Logo 




Gesamt 16 Seiten
CBT3257A Datasheet, Funktion
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
Rev. 01 — 27 October 2005
Product data sheet
1. General description
The CBT3257A is a quad 1-of-2 high-speed TTL-compatible multiplexer/demultiplexer.
The low ON-state resistance of the switch allows inputs to be connected to outputs
without adding propagation delay or generating additional ground bounce noise.
Output enable (OE) and select-control (S) inputs select the appropriate nB1 and nB2
outputs for the nA input data.
The CBT3257A is characterized for operation from 40 °C to +85 °C.
2. Features
s 5 switch connection between two ports
s TTL-compatible input levels
s Minimal propagation delay through the switch
s ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
s Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
3. Ordering information
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DataShee
Table 1: Ordering information
Tamb = 40 °C to +85 °C
Type number Topside
mark
Package
Name
CBT3257AD CBT3257AD SO16
CBT3257ADB C3257A
SSOP16
CBT3257ADS CT3257A
SSOP16 [1]
CBT3257APW CBT3257A TSSOP16
Description
Version
plastic small outline package; 16 leads; SOT109-1
body width 3.9 mm
plastic shrink small outline package;
16 leads; body width 5.3 mm
SOT338-1
plastic shrink small outline package;
16 leads; body width 3.9 mm;
lead pitch 0.635 mm
SOT519-1
plastic thin shrink small outline
SOT403-1
package; 16 leads; body width 4.4 mm
[1] Also known as QSOP16.
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CBT3257A Datasheet, Funktion
www.DataSheet4U.com
Philips Semiconductors
CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
10.1 AC waveforms
VI = GND to 3.0 V.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
tPLH and tPHL are the same as tPD.
input
output
1.5 V
tPLH
1.5 V
Fig 6. Input to output propagation delays
1.5 V
tPHL
3.0 V
0V
VOH
1.5 V
VOL
002aab665
et4U.com
output control
(LOW-level enabling)
1.5 V
DataSheet4Ut.PcZoL m
output
waveform 1
S1 at 7 V(1)
1.5 V
tPZH
output
waveform 2
S1 open(2)
1.5 V
1.5 V
tPLZ
3V
0V
3.5 V
VOL + 0.3 V VOL
tPHZ
VOL 0.3 V VOH
0V
002aab666
(1) Waveform 1 is for an output with internal conditions such that the output is LOW except when
disabled by the output control.
(2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when
disabled by the output control.
Fig 7. 3-state output enable and disable times
DataShee
9397 750 12921
DataSheet4PUro.dcuocmt data sheet
DataSheet4 U .com
Rev. 01 — 27 October 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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CBT3257A pdf, datenblatt
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Philips Semiconductors
CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
et4U.com
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
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below 225 °C (SnPb process) or below 245 °C (Pb-free process)
for all BGA, HTSSON..T and SSOP..T packages
for packages with a thickness 2.5 mm
for packages with a thickness < 2.5 mm and a volume 350 mm3 so called
thick/large packages.
below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
DataShee
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
9397 750 12921
DataSheet4PUro.dcuocmt data sheet
Rev. 01 — 27 October 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
12 of 16
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