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PDF EMIF03-SIM01F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF03-SIM01F2 | |
| Descripción | 3 LINES EMI FILTER INCLUDING ESD PROTECTION | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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®
IPAD™
EMIF03-SIM01F2
3 LINES EMI FILTER
INCLUDING ESD PROTECTION
MAIN PRODUCT APPLICATIONS:
EMI filtering and ESD protection for:
■ SIM Interface (Subscriber Identify Module)
■ UIM Interface (Universal Identify Module)
DESCRIPTION
The EMIF03-SIM01F2 is a highly integrated
devices designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic interfer-
ences. The EMIF03 flip chip packaging means the
package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV.
Flip-Chip
(8 Bumps)
BENEFITS
Table 1: Order Code
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead free package
Part Number
EMIF03-SIM01F2
Marking
FC
■ Very low PCB space consuming:
1.42mm x 1.42mm
Figure 1: Pin Configuration (Ball side)
■ Very thin package: 0.65 mm
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■ High efficiency in ESD suppression
321
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging.
RST RST
in out
A
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4
15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
CLT
in
Gnd
CLT
out
Data
in
VCC
Data
out
B
C
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Figure 2: Configuration
VCC
RST in
CLK in
Data in
100 Ω
R1
47 Ω
R2
100 Ω
R3
RST out
CLK out
Data out
TM: IPAD is a trademark of STMicroelectronics.
December 2004
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GND
REV. 2
Cline = 35pF max.
1/7
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1 page  
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EMIF03-SIM01F2
Figure 10: Ordering Information Scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
= 3: Leadfree Pitch = 400µm, Bump = 250µm
Figure 11: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
et4U.com
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650µm ± 65
DataShee
1.42mm ± 50µm
Figure 12: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 13: Marking
Dot, ST logo
xx = marking
z = packaging
location
yww = datecode
(y = year
ww = week)
All dimensions in µm
365 240
E
xxz
y ww
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