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PDF EMIF10-LCD01F2 Data sheet ( Hoja de datos )

Número de pieza EMIF10-LCD01F2
Descripción EMI FILTER INCLUDING ESD PROTECTION
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



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No Preview Available ! EMIF10-LCD01F2 Hoja de datos, Descripción, Manual

®
IPAD™
EMIF10-LCD01F2
10 LINES EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
LCD for Mobile phones
Computers and printers
Communication systems
MCU Boards
DESCRIPTION
The EMIF10-LCD01F2 is a 10 lines highly inte-
grated devices designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interferences. The EMIF10 Flip-Chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry,
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Very low PCB space consuming: < 7mm2
Lead free package
Very thin package: 0.69 mm
High efficiency in ESD suppression on input
pins (IEC61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration and wafer level packaging.
Flip-Chip
(25 bumps)
Table 1: Order Code
Part Number
EMIF10-LCD01F2
Marking
FL
Figure 1: Pin Configuration (ball side)
54321
I5 I4 I3 I2 I1 A
I10 I9 I8 I7 I6 B
CGND GND GND GND GND
O10 O9 O8 O7 O6 D
O5 O4 O3 O2 O1 E
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2:
Level 4 input pins 15kV (air discharge)
8kV (contact discharge)
MIL STD 833E - Method 3015-6 Class 3
Figure 2: Basic Cell Configuration
Input
Low-pass Filter
Output
Ri/o = 100
Cline = 35pF
GND
GND
GND
TM: IPAD is a trademark of STMicroelectronics.
March 2005
REV. 2
www.DataSheet4U1.c/7om
www.DataSheet4U.com

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EMIF10-LCD01F2 pdf
Figure 13: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
EMIF10-LCD01F2
650µm ± 65
2.64mm ± 50µm
250µm ± 40
Figure 14: Foot Print Recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 15: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
545 400
E
xxz
y ww
5/7

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