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PDF EMIF10-LCD01C1 Data sheet ( Hoja de datos )
| Número de pieza | EMIF10-LCD01C1 | |
| Descripción | EMI FILTER INCLUDING ESD PROTECTION | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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®
IPAD™
EMIF10-LCD01C1
10 LINES EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
■ LCD for Mobile phones
■ Computers and printers
■ Communication systems
■ MCU Boards
DESCRIPTION
The EMIF10-LCD01C1 is a 10 lines highly inte-
grated devices designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interferences. The EMIF10 flip chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry,
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consuming: < 7mm2
■ Coating resin on back side
■ Very thin package: 0.69 mm
■ High efficiency in ESD suppression on input
pins (IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration and wafer level packaging.
Flip-Chip
(25 bumps)
Figure 1: Pin Configuration (ball side)
54321
I5 I4 I3 I2 I1 A
I10 I9 I8 I7 I6 B
CGND GND GND GND GND
O10 O9 O8 O7 O6 D
O5 O4 O3 O2 O1 E
Figure 2: Basic Cell Configuration
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2:
Level 4 input pins 15kV (air discharge)
8kV (contact discharge)
Level 1 output pins 2kV (air discharge)
2kV (contact discharge)
MIL STD 833E - Method 3015-6 Class 3
Input
Low-pass Filter
Output
Ri/o = 100Ω
Cline = 35pF
GND
GND
GND
Table 1: Order Code
Part Number
Marking
EMIF10-LCD01C1
FL
June 2005
REV. 2
www.DataSheet4U1.c/7om
www.DataSheet4U.com
1 page  
Figure 13: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
EMIF10-LCD01C1
695µm ± 75
2.64mm ± 50µm
250µm ± 40
Figure 14: Foot Print Recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 15: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
545 400
xxz
y ww
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF10-LCD01C1.PDF ] | |
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