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PDF EMIF10-COM01 Data sheet ( Hoja de datos )

Número de pieza EMIF10-COM01
Descripción EMI FILTER INCLUDING ESD PROTECTION
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



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No Preview Available ! EMIF10-COM01 Hoja de datos, Descripción, Manual

®
IPAD.TM
EMIF10-COM01
EMI FILTER
INCLUDING ESD PROTECTION
MAIN APPLICATIONS
Where EMI filtering in ESD sensitive equipment is
required:
s Computers and printers
s Communication systems
s Mobile phones
DESCRIPTION
The EMIF10-COM01 is a highly integrated device
designed to suppress EMI / RFI noise in all
systems subjected to electromagnetic
interferences. The EMIF10 flip-chip packaging
means the package size is equal to the die size.
That's why EMIF10-COM01 is a very small device.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
BENEFITS
s EMI symetrical (I/O) low-pass filter
s Very low PCB space consuming:
2.64 x 2.64 mm2
s Very thin package: 0.63 mm
s High efficiency in ESD suppression on both input
& output PINS (IEC61000-4-2 level 4).
s High reliability offered by monolithic integration
COMPLIES WITH FOLLOWING STANDARD:
IEC61000-4-2 level 4 15 KV (air discharge)
8 kV (contact discharge)
Flip Chip package
PIN CONFIGURATION (Ball Side)
1234
E 01 02 03 04
D 06 07 08 09
5
05
010
BASIC CELL CONFIGURATION
C GND GND GND GND GND
Input
Low-pass Filter
Output
B I6 I7 I8 I9 I10
A I1 I2 I3 I4 I5
RI/O = 200
Cinput = 45 pF
ASD is a trademark of STMicroelectronics.
January 2002 - Ed: 5A
www.DataSheet4U.com
www.DataSheet4U.1c/5om

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EMIF10-COM01 pdf
EMIF10-COM01
PACKAGE MECHANICAL DATA
DIE SIZE
500
All dimensions in µm
MARKING
300
2640
s Die size: (2640 ± 50) x (2640 ± 50)
s Die height (including bumps): 650 ± 65
s Bump diameter: 315 ± 50
s Pitch: 500 ± 50
s Weight: 9.3mg
diam 400
®
FET
Y WW
2640 s Y W W: Date code
PACKING:
EMIF10-COM01 is delivered in Tape & Reel (7 inches reel); one Tape & Reel contains 5000 dice.
Note: More packing information are available in the application note AN1235: "Flip-Chip package description and recom-
mendations for use"
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
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