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PDF 80N02 Data sheet ( Hoja de datos )
| Número de pieza | 80N02 | |
| Descripción | NTD80N02 | |
| Fabricantes | ON Semiconductor | |
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NTD80N02
Power MOSFET
24 V, 80 A, N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
www.DataSheet4TUy.pcoicmal Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current − Continuous @ TC = 25°C
Drain Current − Single Pulse (tp = 10 ms)
Total Power Dissipation @ TC = 25°C
Operating and Storage
Temperature Range
VDSS
VGS
ID
IDM
PD
TJ, Tstg
24
±20
80*
200
75
−55 to
150
Vdc
Vdc
Adc
Watts
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 24 Vdc, VGS = 10 Vdc,
IL = 17 Apk, L = 5.0 mH, RG = 25 Ω)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
EAS
RθJC
RθJA
RθJA
TL
733 mJ
°C/W
1.65
67
120
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 1″ pad size,
(Cu Area 1.127 in2).
2. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in2).
*Chip current capability limited by package.
http://onsemi.com
V(BR)DSS
24 V
RDS(on) TYP
5.0 mW
ID MAX
80 A
N−Channel
D
G
S
4
44
12
3
12
3
1 23
CASE 369AA CASE 369C CASE 369D
DPAK
DPAK
DPAK
(Surface Mount) (Surface Mount)(Straight Lead)
STYLE 2
STYLE 2
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
1
Gate
23
Drain Source
13
Gate 2 Source
Drain
Y
WW
80N02
= Year
= Work Week
= Device Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
December, 2004 − Rev. 4
1
Publication Order Number:
NTD80N02/D
1 page  
NTD80N02
100
100 ms
VGS = 10 V
10 SINGLE PULSE
TC = 25°C
1 ms
10 ms
RDS(on) LIMIT
THERMAL LIMIT
dc
PACKAGE LIMIT
1
0.1 1
10 100
VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
www.DataSheet4U.com Figure 11. Maximum Rated Forward Biased
Safe Operating Area
IS
tp
di/dt
trr
ta tb
0.25 IS
IS
TIME
Figure 12. Diode Reverse Recovery Waveform
1000
DUTY CYCLE
100 D = 0.5
0.2
10 0.1
0.05
0.02
1 0.01
0.1
SINGLE PULSE
0.01
1E−05
1E−04
MOUNTED TO MINIMUM RECOMMENDED FOOTPRINT
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
RθJA(t) = r(t) RθJA
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) − TA = P(pk) RθJA(t)
1E−03
1E−02
1E−01
t, TIME (seconds)
1E+00
1E+01
1E+02
1E+03
Figure 13. Thermal Response − Various Duty Cycles
ORDERING INFORMATION
Order Number
Package
Shipping†
NTD80N02
DPAK−3
75 Units / Rail
NTD80N02G
DPAK−3
(Pb−Free)
75 Units / Rail
NTD80N02T4
DPAK−3
2500 / Tape & Reel
NTD80N02T4G
DPAK−3
(Pb−Free)
2500 / Tape & Reel
NTD80N02−001
DPAK−3 Straight Lead
75 Units / Rail
NTD80N02−1G
DPAK−3 Straight Lead
(Pb−Free)
75 Units / Rail
NTD80N02−032
DPAK−3 Straight Lead
(3.2 ± 0.5 mm)
75 Units / Rail
NTD80N02−032G
DPAK−3 Straight Lead
(3.2 ± 0.5 mm)
(Pb−Free)
75 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifi-
cations Brochure, BRD8011/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet 80N02.PDF ] | |
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