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PDF ACSL6210 Data sheet ( Hoja de datos )

Número de pieza ACSL6210
Descripción (ACSL6xx0) Multi-Channel and Bi-Directional / 15 MBd Digital Logic Gate Optocoupler
Fabricantes Agilent 
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No Preview Available ! ACSL6210 Hoja de datos, Descripción, Manual

Agilent ACSL-6xx0
Multi-Channel and Bi-Directional,
15 MBd Digital Logic Gate Optocoupler
Data Sheet
Description
ACSL-6xx0 are truly isolated,
multi-channel and bi-directional,
high-speed optocouplers. Integra-
tion of multiple optocouplers in
monolithic form is achieved
through patented process tech-
nology. These devices provide full
duplex and bi-directional iso-
lated data transfer and communi-
cation capability in compact
surface mount packages. Avail-
able in 15 Mbd speed option and
wide supply voltage range.
These high channel density make
them ideally suited to isolating
data conversion devices, parallel
buses and peripheral interfaces.
Applications
• Full duplex communication
• Isolated line receiver
• Computer-peripheral interfaces
• Microprocessor system interfaces
• Digital isolation for A/D and D/A
conversion
• Switching power supply
• Instrument input/output isolation
• Ground loop elimination
• Pulse transformer replacement
Features
• Available in dual, triple and quad
channel configurations
• Bi-directional
• Wide supply voltage range
3.0V to 5.5V
• High-speed: 15 MBd typical,
10 MBd minimum
• 10 kV/µs minimum Common Mode
Rejection (CMR) at Vcm = 1000 V
• LSTTL/TTL compatible
• Safety and regulatory approvals
(Pending)
– 2500Vrms for 1 min per UL1577
– CSA Component Acceptance
– IEC/EN/DIN EN 60747-5-2
• 16 Pin narrow-body SOIC package
for triple and quad channel
• -40 to 100°C temperature range
They are available in 8-pin and
16pin narrow-body SOIC
package and are specified over
the temperature range of
-40°C to +100° C.
CAUTION:
It is advised that normal static precautions be taken in handling and
assembly of this component to prevent damage and/or degradation,
which may be induced by ESD.

1 page




ACSL6210 pdf
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 ± 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
SOLDERING
TIME
200°C
PEAK
TEMP.
230°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50 100 150 200 250
TIME (SECONDS)
Pb-free IR Profile
5

5 Page










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