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PDF PEF2060 Data sheet ( Hoja de datos )
| Número de pieza | PEF2060 | |
| Descripción | (PEF2260 / PEF2060) Signal Processing Codec Filter | |
| Fabricantes | Infineon Technologies | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de PEF2060 (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
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ICs for Communications
Signal Processing Codec Filter
SICOFI®, SICOFI®-2
User’s Manual 03.92
1 page  
Contents
Introduction
The following chapters inform you about the technical data and programming of the Signal
Processing Codec Filter SICOFI® / SICOFI®-2 PEB 2060/2260 and describe the hardware and
software tools. Application notes show you how to use and work with the SICOFI family in a
given application.
In order to get an overview of the architecture, the devices and the tools, we suggest to start
having a look at the ’General Overview on Architectures and Devices’ as well as ’Development
Support Tools’.
Detailed descriptions can be found in the other chapters.
For more information on related products and quality issues we provide the information on
literature.
Semiconductor Group
5
5 Page 
General Information
Packing of Assembled PC Boards or Flatpack Units
The packing material should exhibit low volume conductivity:
105 Ω/cm < p < 1010 Ω/cm.
In most cases – especially with humidity of > 40 % – this requirement is fulfilled by a simple
corrugated board.
Better protection is obtained with bags of conducitve polyethylene foam (e.g. RCAS 1200
from Richmond of Redlands, California).
You should always ensure that different boards cannot touch.
In special cases it may be necessary to provide protection against strong electric fields,
such as can be generated by conveyor belts for example.
For this purpose a sheath of aluminium foil is recommended, although direct contact
between the film and the PCB must be avoided.
Cardboard boxes with an aluminium-foil lining, such as those used for shipping our devices,
are available from Laber of Munich.
Ultrasonic Cleaning of ICs
The following recommendation applies to plastic packages. For cavity packages (metal and
also ceramic) separate regulations have to be observed.
Freon and isopropyl alcohol (trade name: propanol) can be used as solvents. These
solvents can also be used for plastic packages because they do not eat into the plastic
material.
An ultrasonic bath in double halfwave operation is advisable because of the low component
stress.
The ultrasonic limits are as follows:
sound frequency
exposure
alternating sound pressure
sound power
f > 40 kHz
t < 2 min
p < 29 kPa
N < 0.5 W/cm2/liter
Semiconductor Group
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet PEF2060.PDF ] | |
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