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RC28F320C3 Schematic ( PDF Datasheet ) - Intel

Teilenummer RC28F320C3
Beschreibung (RC28FxxxC3) Boot Block Flash Memory
Hersteller Intel
Logo Intel Logo 




Gesamt 70 Seiten
RC28F320C3 Datasheet, Funktion
Intel® Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
Option
— Reduces overall system power
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword blocks, top or bottom
parameter boot
— Up to 127 x 32 Kword blocks
— Fast program suspend capability
— Fast erase suspend capability
Flexible Block Locking
— Lock/unlock any block
— Full protection on power-up
— Write Protect (WP#) pin for hardware
block protection
Low Power Consumption
— 9 mA typical read
— 7 uA typical standby with Automatic
Power Savings feature
Extended Temperature Operation
— -40 °C to +85 °C
128-bit Protection Register
—64 bit unique device identifier
—64 bit user programmable OTP cells
Extended Cycling Capability
—Minimum 100,000 block erase cycles
Software
—Supported by Intel’s Advanced Flash
File Managers -- Intel® VFM, Intel®
FDI, etc.
—Code and data storage in the same
memory device
—Robust Power Loss Recovery for Data
Loss Prevention
—Common Flash Interface
http://www.intel.com/go/flashsw
Standard Surface Mount Packaging
—48-Ball µBGA*/VFBGA
—64-Ball Easy BGA packages
—48-TSOP package
ETOX™ VIII (0.13 µm) Flash
Technology
—8, 16, 32 Mbit
ETOX™ VII (0.18 µm) Flash Technology
—16, 32 Mbit
ETOX™ VI (0.25 µm) Flash Technology
—8, 16 and 32 Mbit
The Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power
applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel® Flash Data Integrator (Intel® FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel® Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
obtained from the Intel® Flash website: http://www.intel.com/design/flash.
Order Number: 290645, Revision: 023
May 2005






RC28F320C3 Datasheet, Funktion
Intel® Advanced+ Boot Block Flash Memory (C3)
Date of
Revision
4/05/02
3/06/03
10/01/03
5/20/04
9/1/04
9/14/04
9/27/04
1/26/05
5/16/05
Version
-014
-016
-017
-018
-019
-020
-021
-022
-023
Description
Updated 64Mb product offerings.
Updated 16Mb product offerings.
Revised and corrected DC Characteristics Table.
Added mechanicals for Easy BGA.
Minor text edits throughout document.
Complete technical update.
Corrected information in the Device Geometry Details table, address 0x34.
Updated the layout of the datasheet.
Fixed typo for Standby power on cover page.
Added lead-free line items to Table 37 “Product Information Ordering Matrix” on page 72.
Added specification for 8Mb 0.13 micron device.
Added 0.13 micron to Table 37 “Product Information Ordering Matrix” on page 72.
Converted datasheet to new template. Deleted Description in Table 4. Deleted Note in
Figure 5.
Removed all 64M ordering information, removed VF BGA 8M ordering information.
Removed 64M reference in title page only. Added software verbiage in title page. Corrected
Lead Width (b) measurement in Fig 2., uBGA and VF BGA Package Drawing and
Dimensions, page 12.
May 2005
6
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
Datasheet

6 Page









RC28F320C3 pdf, datenblatt
Intel® Advanced+ Boot Block Flash Memory (C3)
3.0 Package Information
3.1 µBGA* and VF BGA Package
Figure 2.
µBGA* and VF BGA Package Drawing and Dimensions
C3 Discrete 8/16/32/64M,
.25,.18, .13u ubga/VFBGA
R0
Ball A1
Corner
D
Ball A1
S1 Corner
1 23 4 5 67 8
A
B
EC
D
E
F
8 7 6 5 4 3 21
A
B
C
D
E
F
b
S2
e
Top View - Bump Side down
Bottom View -Bump side up
A
1
A2
Side View
A Seating
Plan
Y
Note: Drawing not to scale
Dimensions
Symbol
Package Height
A
Ball Height
A1
Package Body Thickness
A2
Ball (Lead) Width
b
Package Body Length 8M (.25)
D
Package Body Length 16M (.25/.18/.13) 32M (.25/.18/.13)
D
Package Body Length 64M (.18)
D
Package Body Width 8M (.25)
E
Package Body Width 16M (.25/.18/.13) 32M (.18/.13)
E
Package Body Width 32M (.25)
E
Package Body Width 64M (.18)
E
Pitch
e
Ball (Lead) Count 8M, 16M
N
Ball (Lead) Count 32M
N
Ball (Lead) Count 64M
N
Seating Plane Coplanarity
Y
Corner to Ball A1 Distance Along D 8M (.25)
S1
Corner to Ball A1 Distance Along D 16M (.25/.18/.13) 32M (.18/.1S31)
Corner to Ball A1 Distance Along D 64M (.18)
S1
Corner to Ball A1 Distance Along E 8M (.25)
S2
Corner to Ball A1 Distance Along E 16M (.25/.18/.13) 32M (.18/.1S32)
Corner to Ball A1 Distance Along E 32M (.25)
S2
Corner to Ball A1 Distance Along E 64M (.18)
S2
Min
0.150
0.325
7.810
7.186
7.600
6.400
6.864
10 . 750
8.900
1.230
0.918
1.125
1.275
1.507
3.450
2.525
Millimeters
Nom Max
1.000
0.665
0.375
7.910
7.286
7.700
6.500
6.964
10.850
9.000
0.750
46
47
48
1.330
1.018
1.225
1.375
1.607
3.550
2.625
0.425
8.010
7.386
7.800
6.600
7.064
10.860
9.100
0.100
1.430
1.118
1.325
1.475
1.707
3.650
2.725
Inches
Min Nom
0.0059
0.0128
0.0262
0.0148
0.2829
0.2992
0.2520
0.2702
0.4232
0.3504
0.2868
0.3031
0.2559
0.2742
0.4272
0.3543
0.0295
46
47
48
0.0484
0.0361
0.0443
0.0502
0.0593
0.1358
0.0994
0.0524
0.0401
0.0482
0.0541
0.0633
0.1398
0.1033
Max
0.0394
0.0167
0.2908
0.3071
0.2598
0.2781
0.4276
0.3583
0.0039
0.0563
0.0440
0.0522
0.0581
0.0672
0.1437
0.1073
May 2005
12
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
Datasheet

12 Page





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