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PDF RC28F800C3 Data sheet ( Hoja de datos )
| Número de pieza | RC28F800C3 | |
| Descripción | (RC28FxxxC3) Boot Block Flash Memory | |
| Fabricantes | Intel | |
| Logotipo |  |
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Intel® Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
■ Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
■ 1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
Option
— Reduces overall system power
■ High Performance
— 2.7 V– 3.6 V: 70 ns max access time
■ Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword blocks, top or bottom
parameter boot
— Up to 127 x 32 Kword blocks
— Fast program suspend capability
— Fast erase suspend capability
■ Flexible Block Locking
— Lock/unlock any block
— Full protection on power-up
— Write Protect (WP#) pin for hardware
block protection
■ Low Power Consumption
— 9 mA typical read
— 7 uA typical standby with Automatic
Power Savings feature
■ Extended Temperature Operation
— -40 °C to +85 °C
■ 128-bit Protection Register
—64 bit unique device identifier
—64 bit user programmable OTP cells
■ Extended Cycling Capability
—Minimum 100,000 block erase cycles
■ Software
—Supported by Intel’s Advanced Flash
File Managers -- Intel® VFM, Intel®
FDI, etc.
—Code and data storage in the same
memory device
—Robust Power Loss Recovery for Data
Loss Prevention
—Common Flash Interface
— http://www.intel.com/go/flashsw
■ Standard Surface Mount Packaging
—48-Ball µBGA*/VFBGA
—64-Ball Easy BGA packages
—48-TSOP package
■ ETOX™ VIII (0.13 µm) Flash
Technology
—8, 16, 32 Mbit
■ ETOX™ VII (0.18 µm) Flash Technology
—16, 32 Mbit
■ ETOX™ VI (0.25 µm) Flash Technology
—8, 16 and 32 Mbit
The Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power
applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel® Flash Data Integrator (Intel® FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel® Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
obtained from the Intel® Flash website: http://www.intel.com/design/flash.
Order Number: 290645, Revision: 023
May 2005
1 page  
Revision History
Intel® Advanced+ Boot Block Flash Memory (C3)
Date of
Revision
05/12/98
07/21/98
10/03/98
12/04/98
12/31/98
02/24/99
06/10/99
03/20/00
04/24/00
10/12/00
7/20/01
10/02/01
2/05/02
Version
-001
-002
-003
-004
-005
-006
-007
-008
-009
-010
-011
-012
-013
Description
Original version
48-Lead TSOP package diagram change
µBGA package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional Features and
Command Support change (Table C8)
Protection Register Address Change
IPPD test conditions clarification (Section 4.3)
µBGA package top side mark information clarification (Section 6)
Byte-Wide Protection Register Address change
VIH Specification change (Section 4.3)
VIL Maximum Specification change (Section 4.3)
ICCS test conditions clarification (Section 4.3)
Added Command Sequence Error Note (Table 7)
Datasheet renamed from 3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash Memory
Family.
Added tBHWH/tBHEH and tQVBL (Section 4.6)
Programming the Protection Register clarification (Section 3.4.2)
Removed all references to x8 configurations
Removed reference to 40-Lead TSOP from front page
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
Locking Operations Flowchart changed (Appendix B)
Added tWHGL (Section 4.6)
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
Max ICCD changed to 25 µA
Table 10, added note indicating VCCMax = 3.3 V for 32-Mbit device
Added specifications for 0.18 micron product offerings throughout document Added 64-
Mbit density
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
Changed VccMax=3.3V reference to indicate that the affected product is the 0.25µm
32Mbit device.
Minor text edits throughout document.
Added 1.8v I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’
Added ‘Vssq’ to Pin Descriptions Information
Removed 0.4 µm references in DC characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected ‘bottom’ parameter block sizes to on 8Mb device to 8 x 4KWords
Minor text edits throughout document
Added specifications for 0.13 micron product offerings throughout document
Corrected Iccw / Ippw / Icces /Ippes values.
Added mechanicals for 16Mb and 64Mb
Minor text edits throughout document.
Datasheet
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
May 2005
5
5 Page 
Intel® Advanced+ Boot Block Flash Memory (C3)
Table 2.
Bottom Boot Memory Map
Size
(KW)
Blk
8-Mbit
Memory
Addressing
(Hex)
32 22 78000-7FFFF
Size
(KW)
Blk
32 38
16-Mbit
Memory
Addressing
(Hex)
F8000-FFFFF
32 21 70000-77FFF
32 37 F0000-F7FFF
32 20 68000-6FFFF
32 19 60000-67FFF
32 36 E8000-EFFFF
32 35 E0000-E7FFF
... ...
...
... ...
...
32 10 18000-1FFFF
32 10 18000-1FFFF
32 9 10000-17FFF
32 9 10000-17FFF
32 8 08000-0FFFF
32 8 08000-0FFFF
4 7 07000-07FFF
4 7 07000-07FFF
4 6 06000-06FFF
4 5 05000-05FFF
4 6 06000-06FFF
4 5 05000-05FFF
4 4 04000-04FFF
4 4 04000-04FFF
4 3 03000-03FFF
4 3 03000-03FFF
4 2 02000-02FFF
4 2 02000-02FFF
4 1 01000-01FFF
4 1 01000-01FFF
4 0 00000-00FFF
4 0 00000-00FFF
Size
(KW)
Blk
32-Mbit
Memory
Addressing
(Hex)
32 70 1F8000-1FFFFF
32 69 1F0000-1F7FFF
32 68 1E8000-1EFFFF
32 67 1E0000-1E7FFF
... ...
...
32 10 18000-1FFFF
32 9 10000-17FFF
32 8 08000-0FFFF
4 7 07000-07FFF
4 6 06000-06FFF
4 5 05000-05FFF
4 4 04000-04FFF
4 3 03000-03FFF
4 2 02000-02FFF
4 1 01000-01FFF
4 0 00000-00FFF
Size
(KW)
Blk
64-Mbit Memory
Addressing (Hex)
32 134 3F8000-3FFFFF
32 133 3F0000-3F7FFF
32 132 3E8000-3EFFFF
32 131 3E0000-3E7FFF
. ...
...
32 10
18000-1FFFF
32 9
10000-17FFF
32 8
08000-0FFFF
47
07000-07FFF
46
06000-06FFF
45
05000-05FFF
44
04000-04FFF
43
03000-03FFF
42
02000-02FFF
41
01000-01FFF
40
00000-00FFF
Datasheet
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
May 2005
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet RC28F800C3.PDF ] | |
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