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RMBA19500 Schematic ( PDF Datasheet ) - Fairchild Semiconductor

Teilenummer RMBA19500
Beschreibung PCS 2 Watt Linear GaAs MMIC Power Amplifier
Hersteller Fairchild Semiconductor
Logo Fairchild Semiconductor Logo 




Gesamt 7 Seiten
RMBA19500 Datasheet, Funktion
May 2004
RMBA19500
PCS 2 Watt Linear GaAs MMIC Power Amplifier
General Description
The RMBA19500 is a highly linear Power Amplifier. The
circuit uses our pHEMT process. It has been designed for
use as a driver stage for PCS base stations, or as the
output stage for Micro- and Pico-Cell base stations. The
amplifier has been optimized for high linearity requirements
for CDMA operation.
Features
• 2 Watt Linear output power at 36dBc ACPR1 for CDMA
operation
• Small signal gain of 30dB typ.
• Small outline SMD package
Device
Absolute Ratings
Symbol
Vd
Vg
PRF
TC
TS
Parameter
Drain Supply Voltage1
Gate Supply Voltage
RF Input Power (from 50source)
Operating Case Temperature Range
Storage Temperature Range
Note:
1. Only under quiescent conditions—no RF applied.
Ratings
+10
-5
+5
-30 to +85
-40 to +100
Units
V
V
dBm
°C
°C
©2003 Fairchild Semiconductor Corporation
RMBA19500 Rev. C






RMBA19500 Datasheet, Funktion
Parts List for Test Evaluation Board (RMBA19500-TB, G6655917)
Part
L1, L2, L4
L3
C1
C9
C3, C4, C5
C10
C2
C8, C11, C14, C15
C6, C7
R1, R5
R2, R7
R3
R4
R6
R8
R9
U1
HS
P1
J1, J2
Board FR4
Value
5.6nH
10nH
10pF
2.2pF
1500pF
2.0pF
15.0pF
4.7µF
0.1µF
20
1000
910
30
1.1K
390
300
RMBA19500
Heatsink
Terminals
SMA Connectors
Size (EIA)
.06" x .03"
.085" x .060"
.067" x .036"
.042" x .022"
.067" x .036"
.042" x .022"
.134" x .071"
.183" x .054"
.069" x .037"
.069" x .037"
.069" x .037"
.069" x .037"
.069" x .037"
.31" x .41"
Vendor(s)
Toko (LL1608-F5N6)
Coilcraft (0805HT-10NTKBC)
Murata (GRM39COG100J050AD)
Murata (GRM36COG2R2J050BD)
Murata (GRM39Y5V152Z50V)
Murata (GRM36COG2R20J050BD)
Murata (GRM36COG150J050)
TDK (C3216XR1A475KT)
Murata (GRM39Y5V104Z50)
IMS (RCI-0603-20R0J)
IMS (RCI-0603-1001J)
IMS (RCI-0603-9100J)
IMS (RCI-0603-30R0J)
IMS (RCI-0603-1101J)
IMS (RCI-0603-3900J)
IMS (RCI-0603-3000J)
Fairchild
Fairchild, G655548
3M (2340-5211TN)
E.F. Johnson (142-0701-841)
Fairchild Dwg# G654187/G654941
Thermal Considerations for Heat Sinking the RMBA19500
The PWB must be prepared with either an embedded
copper slug in the board where the package is to be
mounted or a heat sink should be attached to the backside
of the PWB where the package is to be mounted on the
front side. The slug or the heat sink should be made of a
highly electrically and thermally conductive material such
as copper or aluminum. The slug should be at least the
same thickness as the PWB. In the case of the heat sink, a
small pedestal should protrude through a hole in the PWB
where the package bottom is directly soldered. In either
configuration, the top surface of the slug or the pedestal
should be made coplanar with the package lead mounting
plane i.e., the top surface of the PWB. Use Sn96 solder
(96.5% Sn and 3.5% Ag) at 220°C for 20 seconds or less to
attach the heat sink to the backside of the PWB. Then,
using Sn63, the package bottom should be firmly soldered
to the slug or the pedestal while the pins are soldered to the
respective pads on the front side of the PWB without
causing any stress on the pins. Remove flux completely if
used for soldering.
©2003 Fairchild Semiconductor Corporation
RMBA19500 Rev. C

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