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Teilenummer | DIP24 |
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Beschreibung | Thermal Data | |
Hersteller | STMicroelectronics | |
Logo | ||
Gesamt 2 Seiten ® Thermal Data
DIP 24
24 leads
PACKAGE MATERIAL LIST
item #
leadframe
die attach
molding
compound
material
copper
epoxy glue
( silver filler )
epoxy resin
thickness
0.25 mm
10-40 µm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
3 mm
0.0063W/cm°C
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time width and die size
February 1998
1/2
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Seiten | Gesamt 2 Seiten | |
PDF Download | [ DIP24 Schematic.PDF ] |
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