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PC28F160C3TD70 Schematic ( PDF Datasheet ) - Intel

Teilenummer PC28F160C3TD70
Beschreibung Advanced Boot Block Flash Memory
Hersteller Intel
Logo Intel Logo 




Gesamt 30 Seiten
PC28F160C3TD70 Datasheet, Funktion
Intel® Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
Option
— Reduces overall system power
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword blocks, top or bottom
parameter boot
— Up to 127 x 32 Kword blocks
— Fast program suspend capability
— Fast erase suspend capability
Flexible Block Locking
— Lock/unlock any block
— Full protection on power-up
— Write Protect(WP#) pin for hardware
block protection
Low Power Consumption
— 9 mA typical read
— 7 uA typical standby with Automatic
Power Savings feature
Extended Temperature Operation
— -40 °C to +85 °C
128-bit Protection Register
— 64 bit unique device identifier
— 64 bit user programmable OTP cells
Extended Cycling Capability
— Minimum 100,000 block erase cycles
Software
— Intel® Flash Data Integrator
— Supports top or bottom boot storage,
streaming data (for example, voice)
— Intel Basic Command Set
— Common Flash Interface
Standard Surface Mount Packaging
— 48-Ball µBGA*/VFBGA
— 64-Ball Easy BGA packages
— 48-TSOP package
ETOX™ VIII (0.13 µm) Flash
Technology
— 8, 16, 32 Mbit
ETOX™ VII (0.18 µm) Flash Technology
— 16, 32, 64 Mbit
ETOX™ VI (0.25 µm) Flash Technology
— 8, 16 and 32 Mbit
The Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power
applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel® Flash Data Integrator (Intel® FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel® Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
obtained from the Intel® Flash website: http://www.intel.com/design/flash.
Order Number: 290645, Revision: 022
January 2005






PC28F160C3TD70 Datasheet, Funktion
Intel® Advanced+ Boot Block Flash Memory (C3)
Date of
Revision
4/05/02
3/06/03
10/01/03
5/20/04
9/1/04
9/14/04
9/27/04
1/26/05
Version
-014
-016
-017
-018
-019
-020
-021
-022
Description
Updated 64Mb product offerings.
Updated 16Mb product offerings.
Revised and corrected DC Characteristics Table.
Added mechanicals for Easy BGA.
Minor text edits throughout document.
Complete technical update.
Corrected information in the Device Geometry Details table, address 0x34.
Updated the layout of the datasheet.
Fixed typo for Standby power on cover page.
Added lead-free line items to Table 37 “Product Information Ordering Matrix” on page 72.
Added specification for 8Mb 0.13 micron device.
Added 0.13 micron to Table 37 “Product Information Ordering Matrix” on page 72.
Converted datasheet to new template. Deleted Description in Table 4. Deleted Note in
Figure 5.
January 2005
6
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 022
Datasheet

6 Page









PC28F160C3TD70 pdf, datenblatt
Intel® Advanced+ Boot Block Flash Memory (C3)
3.0 Package Information
3.1 µBGA* and VF BGA Package
Figure 2. µBGA* and VF BGA Package Drawing and Dimensions
Ball A1
Corner
D
Ball A1
S1 Corner
1 23 4 5 67 8
A
B
EC
D
E
F
8 7 6 5 4 3 21
A
B
C
D
E
F
b
S2
e
Top View - Bump Side down
Bottom View -Bump side up
A
1
A2
Side View
A Seating
Plan
Y
Note: Drawing not to scale
Dimens ions
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Length 8M (.25)
Package Body Length 16M (.25/.18/.13) 32M (.25/.18/.13)
Package Body Length 64M (.18)
Package Body Width 8M (.25)
Package Body Width 16M (.25/.18/.13) 32M (.18/.13)
Package Body Width 32M (.25)
Package Body Width 64M (.18)
Pitch
Ball (Lead) Count 8M, 16M
Ball (Lead) Count 32M
Ball (Lead) Count 64M
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D 8M (.25)
Corner to Ball A1 Distance Along D 16M (.25/.18/.13) 32M (.18/.13)
Corner to Ball A1 Distance Along D 64M (.18)
Corner to Ball A1 Distance Along E 8M (.25)
Corner to Ball A1 Distance Along E 16M (.25/.18/.13) 32M (.18/.13)
Corner to Ball A1 Distance Along E 32M (.25)
Corner to Ball A1 Distance Along E 64M (.18)
Symbol
A
A1
A2
b
D
D
D
E
E
E
E
e
N
N
N
Y
S1
S1
S1
S2
S2
S2
S2
Min
0.150
0.325
7.810
7.186
7.600
6.400
6.864
10.750
8.900
1.230
0.918
1.125
1.275
1.507
3.450
2.525
Millimeters
Nom Max
1.000
0.665
0.375
7.910
7.286
7.700
6.500
6.964
10.850
9.000
0.750
46
47
48
1.330
1.018
1.225
1.375
1.607
3.550
2.625
0.425
8.010
7.386
7.800
6.600
7.064
10.860
9.100
0.100
1.430
1.118
1.325
1.475
1.707
3.650
2.725
Min
0.0059
0.0128
0.2829
0.2992
0.2520
0.2702
0.4232
0.3504
0.0484
0.0361
0.0443
0.0502
0.0593
0.1358
0.0994
Inches
Nom
0.0262
0.0148
0.2868
0.3031
0.2559
0.2742
0.4272
0.3543
0.0295
46
47
48
0.0524
0.0401
0.0482
0.0541
0.0633
0.1398
0.1033
Max
0.0394
0.0167
0.2908
0.3071
0.2598
0.2781
0.4276
0.3583
0.0039
0.0563
0.0440
0.0522
0.0581
0.0672
0.1437
0.1073
January 2005
12
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 022
Datasheet

12 Page





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